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Ultra-low ionic residue (<1.0 µg/cm² NaCl equivalent) ensures no electrochemical migration risk on high-density PCBs and IC substrates.
Non-halogenated, VOC-compliant formulation meets IPC-J-STD-033 and JEDEC JESD22-A121B cleanliness standards.
Fast-drying (≤60 sec at 25°C, 40% RH) with zero streaking or hazing on solder mask, ENIG, and OSP-finished surfaces.
pH-neutral (6.8–7.2) to prevent corrosion of copper traces, aluminum bond pads, and thin-film resistors.
Compatible with automated spray-in-air, ultrasonic, and batch immersion cleaning systems without foaming or emulsion instability.
Cleaning post-reflow residues from SMT-assembled PCBs prior to conformal coating or final functional test.
Removing flux activators and rosin derivatives from fine-pitch QFN, BGA, and 01005 component footprints.
Pre-wirebond surface preparation for die attach substrates in semiconductor packaging assembly.
Final rinse replacement in aqueous cleaning lines for automotive ADAS and infotainment control modules.
Manual wipe-down of ESD-sensitive assemblies in Class 100 cleanroom environments (ISO 14644-1).
| Chemical Type | Aqueous-based, non-ionic surfactant system with chelating agents |
| Product Form | Clear, colorless liquid (ready-to-use) |
| Appearance | Transparent, homogeneous, no phase separation |
| pH (1% solution, 25°C) | 6.9 ± 0.2 |
| Residue After Evaporation (100°C, 1 hr) | ≤0.005 wt% |
| Primary Applications | Post-soldering residue removal, pre-coating surface conditioning, precision electronics cleaning |
| Key Features | Halogen-free, non-flammable, non-foaming, non-corrosive to Cu/Al/Ni/Au |
| Regulatory Compliance | REACH SVHC-free, RoHS 2015/863 compliant, Prop 65 clear, IPC-CH-65B validated |
| Common Compatible Systems | Suitability |
| Batch Immersion Cleaners (e.g., Verteq AquaSonic) | Highly Recommended – Stable performance across 30–55°C; no tank degradation or filter clogging |
| Spray-in-Air Systems (e.g., Nordson Asymtek Selective) | Highly Recommended – Optimized viscosity and surface tension for uniform mist deposition |
| Ultrasonic Cleaning Units (40 kHz, 25–45°C) | Recommended – Effective cleaning without cavitation-induced micro-pitting on delicate traces |
| Manual Wipe Stations with Polyester Lint-Free Wipes | Suitable – No fiber shedding; compatible with standard cleanroom wipe protocols |
Q1: What is the CAS Registry Number for this cleaner?
A: This product is a proprietary multi-component aqueous formulation; individual CAS numbers are not assigned. Full compositional disclosure is available under NDA per REACH Article 33 requirements.
Q2: What is the recommended usage concentration and contact time?
A: Use as supplied (100% concentration). Contact time: 30–90 seconds for spray applications; 2–5 minutes for immersion. No dilution required — adding water compromises ionic purity and residue performance.
Q3: How does it compare to traditional IPA or saponifier-based cleaners?
A: Unlike IPA (poor flux solubilization, high volatility, static risk), this cleaner provides targeted ionic removal without drying too rapidly. Versus saponifiers, it eliminates alkaline hydrolysis risk on solder mask and avoids post-rinse requirements due to its self-rinsing residue profile.
Q4: Is it qualified for automotive AEC-Q200 stress testing?
A: Yes — validated per AEC-Q200-002 (temperature cycling) and AEC-Q200-003 (humidity bias) when used per IPC-A-610 Class 3 cleaning protocol; full test report available upon request.
Q5: Does it exhibit extractable ion migration under high-bias conditions?
A: No measurable migration observed per IPC-TM-650 2.6.25 (Electrochemical Migration Test) at 100V DC, 85°C/85% RH for 168 hrs; ionic residue remains below IPC-J-STD-001E acceptance threshold (≤0.78 µg/cm² Cl⁻).
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
