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Prevents premature copper layer thinning during high-temperature PCB etching and plating processes.
Enhances bath stability and extends operational life of acidic copper etchants.
Minimizes copper redeposition and micro-roughness on fine-line circuit features.
Non-volatile and low-foaming for consistent performance in automated immersion and spray systems.
Compatible with standard monitoring and dosing equipment used in industrial PCB fabrication lines.
High-density interconnect (HDI) printed circuit board manufacturing.
Advanced IC substrate etching for fan-out wafer-level packaging (FOWLP).
Flexible printed circuit (FPC) processing with ultra-thin copper foils (≤12 µm).
Automotive electronics requiring tight line-width control and thermal reliability.
Aerospace-grade multilayer PCB production with stringent defect tolerance.
| Chemical Type | Organophosphorus-based chelating stabilizer |
| Product Form | Clear, amber liquid concentrate |
| Appearance | Homogeneous, free from sediment or phase separation |
| pH (1% aqueous solution) | 5.8 – 6.4 at 25°C |
| Density (20°C) | 1.08 – 1.12 g/cm³ |
| Primary Applications | Copper thinning control in acidic chloride/sulfate etchants |
| Key Features | Thermal stability up to 65°C; non-oxidizing; low metal ion interference |
| Regulatory Compliance | REACH compliant; RoHS 2015/863 Annex II; no SVHCs above threshold |
| Common Compatible Systems | Suitability |
| Acidic Copper Chloride Etchant Systems | Highly Recommended – Proven efficacy in CuCl₂/NH₄Cl/HCl formulations |
| Sulfuric Acid–Hydrogen Peroxide (SPS) Etchants | Recommended – Requires minor dosage optimization for stable thinning rate |
| Commercial PCB Etch Additive Packages (e.g., Enthone® CSE, MacDermid Alpha® ETCH-PLUS) | Suitable – Functions as synergistic stabilizer without formulation conflict |
| Alkaline Ammoniacal Etchants | Not Recommended – Incompatible due to pH-driven decomposition |
Q1: What is the CAS Registry Number for Copper Thinning Stabilizer?
A: The product is a proprietary multi-component formulation; individual CAS numbers are not assigned. Full ingredient disclosure is available under NDA upon request for regulatory review.
Q2: What is the recommended dosage range in copper etchant baths?
A: Typical dosage is 0.5–2.0 mL/L, adjusted based on etch rate, temperature, and copper load; continuous monitoring via titration or online UV-Vis is advised for optimal control.
Q3: How does it differ from conventional copper corrosion inhibitors?
A: Unlike general corrosion inhibitors, it selectively modulates copper dissolution kinetics—stabilizing the thinning step without suppressing overall etch activity or compromising sidewall profile integrity.
Q4: Is it subject to food contact or migration testing requirements?
A: Not applicable — it is strictly for industrial PCB manufacturing; no intended use in food-contact or medical device final assemblies. Residual traces are removed during post-etch rinsing and meet IPC-6012 cleanliness standards.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
