English
Español
tiếng việt
русский
Autocatalytic deposition enables uniform, pinhole-free silver coatings on non-conductive substrates without external current.
Room-temperature operation reduces energy consumption and simplifies process integration in ambient manufacturing environments.
High electrical conductivity (≈ 5–7 × 10⁶ S/m) achieved directly after plating, suitable for functional EMI shielding and conductive traces.
Excellent adhesion to diverse substrates including ABS, polyimide, PET, and ceramic composites after proper surface activation.
Low bath decomposition tendency with robust stabilization, supporting extended operational bath life under controlled pH and temperature.
EMI/RFI shielding for medical electronics enclosures and aerospace avionics housings.
Conductive patterns on flexible printed electronics (FPE), including touch sensors and wearable circuitry.
Metallization of 3D-printed polymer parts for subsequent electroplating or solderable interconnects.
Antistatic coatings for optical lenses, display frames, and cleanroom-compatible plastic components.
Seed layers for high-resolution microelectronics packaging and advanced heterogeneous integration substrates.
| Chemical Type | Aqueous alkaline complex solution containing silver ammine ions, reducing agents (e.g., formaldehyde or sugar derivatives), and stabilizers |
| Product Form | Liquid concentrate (typically supplied as multi-component kit: Solution A + Solution B + Activator) |
| Appearance | Clear, colorless to pale yellow liquid (Solution A); colorless to light amber liquid (Solution B) |
| pH Range (Operating) | 11.8 – 12.5 at 25°C |
| Deposition Temperature | 20 – 30°C (ambient to mild heating) |
| Primary Applications | Non-electrolytic metallization of plastics, ceramics, and composites for conductivity and EMI shielding |
| Key Features | Self-initiating, no pre-catalyst required for activated surfaces; low silver ion concentration (≤ 2.5 g/L Ag⁺) |
| Regulatory Compliance | REACH SVHC compliant; RoHS 2015/863 Annex II compliant;不含PFOA、PFOS、NDMA |
| Common Compatible Systems | Suitability |
| ABS Plastic (chromic acid etched) | Highly Recommended – Provides optimal micro-roughness and Pd/Sn activation synergy |
| Polyimide (O₂ plasma + Pd-activated) | Recommended – Requires precise plasma parameters and rinse control to ensure uniform nucleation |
| PPS and LCP (with proprietary sulfonation + Pd catalyst) | Suitable – Achieves >95% coverage with optimized pre-treatment sequence |
| Alumina Ceramic (Pd-activated) | Recommended – Stable adhesion up to 250°C thermal cycling; no blistering observed |
Q1: What is the CAS Registry Number for Electroless Silver plating solution?
A: Electroless Silver is a multi-component formulation; individual active ingredients have distinct CAS numbers — e.g., silver nitrate (7761-88-8), tetraammine silver hydroxide (11113-74-9). Full formulation CAS is not assigned per IUPAC guidelines for mixtures.
Q2: What is the typical silver deposition rate, and how does it affect coating thickness control?
A: Deposition rate ranges from 0.05–0.15 µm/min under standard conditions (25°C, pH 12.2). Thickness is linearly time-dependent within 0.1–2.0 µm range, enabling precise control via immersion duration without need for real-time monitoring.
Q3: How does Electroless Silver compare to Electroless Copper in terms of migration resistance and ionic contamination?
A: Electroless Silver exhibits lower ionic mobility than copper under humid bias conditions due to higher lattice energy and absence of soluble Cu²⁺ species. Extractable silver ion levels remain <0.5 ppm after IPC-TM-650 2.6.25 testing, meeting Class 2 electronic assembly requirements.
Q4: Is this product certified for use in food-contact or pharmaceutical equipment applications?
A: Not intended for direct food-contact surfaces. Complies with USP <87> and <88> cytotoxicity testing for plastic components (extractables ≤ 50 µg/cm²), but lacks FDA 21 CFR 175.300 or EC 1935/2004 food-contact certification. Use requires end-product risk assessment.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
