Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

DAICEL EPOLEAD PB3600 Epoxy Resin

DAICEL EPOLEAD PB3600 is a high-performance brominated epoxy resin from the EPOLEAD series, offering excellent flame retardancy, thermal stability and adhesion for PCB laminates and advanced composites. It features low ionic impurities, superior dielectric properties and compatibility with standard curing agents—ideal for high-reliability electronic applications demanding UL94 V-0 rating.
  • daicel epolead pb3600 epoxy resin_8a43d86c
  • daicel epolead pb3600 epoxy resin_8a43d86c

Features Of DAICEL EPOLEAD PB3600 Epoxy Resin

  1. Highly reactive liquid epoxy resin with low viscosity for excellent processability and impregnation.

  2. Designed for fast cure kinetics, enabling efficient high-speed composite manufacturing cycles.

  3. Delivers superior mechanical strength and thermal stability in cured laminates.

  4. Compatible with standard amine and anhydride curing agents used in industrial thermoset systems.

  5. Low chloride content ensures enhanced electrical insulation properties and corrosion resistance.

Typical Applications Of DAICEL EPOLEAD PB3600 Epoxy Resin

  1. Aerospace structural composites requiring high glass transition temperature (Tg) and dimensional stability.

  2. Wind turbine blade matrices where fatigue resistance and resin flow control are critical.

  3. Electrical insulation systems for high-voltage equipment and power transformers.

  4. Automotive lightweight components including battery enclosures and under-hood structural parts.

  5. Prepreg and infusion-grade carbon fiber composites for industrial and sporting goods applications.

Specifications Of DAICEL EPOLEAD PB3600 Epoxy Resin

Chemical TypeDiglycidyl ether of bisphenol-A (DGEBA) type epoxy resin
Product FormClear to pale yellow low-viscosity liquid
AppearanceTransparent, homogeneous liquid at 25°C
Epoxy Equivalent Weight (EEW)185–195 g/eq
Viscosity (25°C)12,000–16,000 mPa·s
Chloride Content≤ 500 ppm
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsComposite matrix resins, electrical encapsulation, high-performance laminates


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