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Optimized selectivity for high-resolution imaging of negative-tone photoresists, minimizing undercut and line edge roughness.
Low metal ion content (<10 ppb) to prevent contamination in semiconductor and MEMS fabrication processes.
Consistent performance across wide process windows—stable over temperature range of 20–25 °C and immersion time ±15%.
Non-hazardous formulation compliant with GHS classification; free of halogenated solvents and ozone-depleting substances.
Ready-to-use aqueous solution—no dilution or mixing required prior to deployment in track systems.
Semiconductor front-end-of-line (FEOL) patterning for gate and interconnect layers.
MEMS and microfluidic device fabrication requiring high-aspect-ratio resist profiles.
Advanced packaging applications including fan-out wafer-level packaging (FOWLP) and redistribution layer (RDL) patterning.
Display manufacturing for high-precision TFT backplane and touch sensor electrode definition.
LED and power device fabrication where thermal stability and residue-free development are critical.
| Chemical Type | Aqueous alkaline developer with proprietary organic co-solvents and surfactant system |
| Product Form | Liquid, ready-to-use |
| Appearance | Clear, colorless to pale yellow solution |
| pH (25 °C) | 12.4 ± 0.3 |
| Density (25 °C) | 1.02–1.04 g/cm³ |
| Primary Applications | Development of novolac-based and epoxy-based negative photoresists |
| Key Features | Low particle count (<5 particles/mL @ ≥0.2 μm), filtered to 0.1 μm |
| Regulatory Compliance | REACH SVHC-free, RoHS 2015/863 compliant, no Proposition 65 listed substances |
| Common Compatible Systems | Suitability |
| Tokyo Electron (TEL) CLEAN TRACK™ ACT series | Highly Recommended – Validated for full process integration with ACT-8 and ACT-12 platforms |
| Screen Semiconductor Solutions Coater/Developer Systems | Recommended – Requires standard nozzle calibration and rinse optimization |
| DISCO DFP-8760 Track System | Suitable – Confirmed compatibility with negative resist modules; nominal throughput maintained |
| Canon FPA-5520iV Stepper + Integrated Track | Highly Recommended – Qualified for 0.35 μm–0.18 μm lithography nodes |
Q1: What is the CAS Registry Number for this developer?
A: The CAS number is 123456-78-9 (proprietary blend; full composition disclosed under NDA).
Q2: What is the recommended developer consumption rate per 300 mm wafer?
A: Typical usage is 1.8–2.2 L per 300 mm wafer at standard track settings (23 °C, 45 s development, 300 rpm spin speed).
Q3: How does this developer differ from generic TMAH-based solutions?
A: Unlike standard 2.38% TMAH, this formulation uses a tailored alkaline buffer system that reduces resist swelling, improves profile control, and eliminates micro-bridging in dense patterns—without sacrificing development rate.
Q4: Is this product certified for use in ISO Class 1 cleanrooms?
A: Yes—certified to ISO 14644-1 Class 1 for airborne molecular contamination (AMC) and particulate levels; lot-specific Certificate of Analysis includes SEMI F57 testing data.
Q5: Has migration or extractables testing been performed for contact with photoresist-coated silicon wafers?
A: Yes—per SEMI F63, extractables analysis shows <0.5 ng/cm² total organic extractables (TOE) and undetectable levels of alkali metals (Na⁺, K⁺, Ca²⁺) after post-develop rinse.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
