English
Español
tiếng việt
русский
High thermal stability with continuous service up to 200 °C.
Excellent electrical insulation properties across wide temperature and frequency ranges.
Good adhesion to metals, glass, and cured silicone elastomers without priming.
Solvent-based formulation (xylene/toluene blend) enabling easy application by dipping, spraying, or brushing.
Cures at elevated temperatures to form a hard, transparent, non-tacky film with low internal stress.
Electrical insulation coating for magnet wire and coil windings.
Protective overcoat for high-temperature sensors and electronic components.
Binding agent in high-temperature abrasive wheels and refractory composites.
Surface treatment for fiberglass and ceramic substrates prior to metalizing or laminating.
Matrix resin in specialty high-heat gasketing and sealing compounds.
| Chemical Type | Methyl-phenyl silicone resin |
| Product Form | Clear, viscous liquid solution |
| Appearance | Colorless to pale yellow, transparent |
| Solvent System | Xylene/toluene mixture |
| Solids Content | 50–55 wt% (typical) |
| Viscosity (25 °C) | 1,500–3,000 cP (Brookfield LV, #3 spindle, 12 rpm) |
| Density (25 °C) | 0.94–0.97 g/cm³ |
| Cure Schedule | 150 °C for 30 min, then 200 °C for 60 min (film formation) |
Q1: What is the primary function of Dow Corning 18 Silicone Resin in coating and ink formulations?
A: Dow Corning 18 Silicone Resin is primarily used as a surface modifier to enhance slip, mar resistance, and substrate wetting. It migrates to the film surface during curing or drying, forming a low-energy layer that improves rub resistance and reduces coefficient of friction without significantly affecting gloss or adhesion.
Q2: Is Dow Corning 18 compatible with common organic resin systems such as acrylics, polyesters, and alkyds?
A: Yes, Dow Corning 18 exhibits good compatibility with a broad range of thermosetting and thermoplastic organic resins, including acrylics, polyesters, and alkyds—particularly in solvent-borne and high-solids systems. Compatibility should be verified experimentally in each specific formulation due to variations in polarity, molecular weight, and cure chemistry.
Q3: How is Dow Corning 18 typically incorporated into a formulation?
A: It is generally added during the let-down stage using standard high-shear mixing equipment. Pre-dilution in a compatible solvent (e.g., xylene, Solvesso™, or butyl acetate) may improve dispersion uniformity. Avoid prolonged high-temperature exposure prior to application, as premature surface migration can occur.
Q4: Does Dow Corning 18 affect the curing behavior or crosslink density of thermoset coatings?
A: Dow Corning 18 is non-reactive and does not participate in covalent crosslinking reactions. It functions as a physical additive and typically does not interfere with catalyst activity or overall network formation. However, at elevated loadings, it may slightly influence film formation kinetics or final hardness development due to phase segregation.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
