Low-viscosity liquid epoxy resin for enhanced processability and easy handling in formulation.
Excellent chemical resistance, particularly to alkalis, solvents, and mild acids.
High reactivity with amines and anhydrides, enabling rapid cure kinetics and efficient production cycles.
Superior adhesion to metals, composites, and concrete substrates.
Good electrical insulation properties and low moisture absorption for reliable performance in demanding environments.
Electrical encapsulation and potting compounds for transformers, sensors, and power electronics.
High-performance composite matrices for aerospace and wind energy components.
Structural adhesives used in automotive and rail transportation bonding applications.
Protective coatings for industrial flooring, marine decks, and chemical plant infrastructure.
Tooling resins for molds, jigs, and master patterns requiring dimensional stability and low shrinkage.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chlorine Content | < 1,000 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, composites, adhesives, coatings, tooling |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China