High-purity, low-chloride bisphenol-A based epoxy resin for enhanced electrical insulation performance.
Excellent thermal stability and glass transition temperature (Tg) suitable for demanding curing profiles.
Low viscosity in liquid form, enabling easy handling, mixing, and impregnation into complex substrates.
Superior adhesion to metals, ceramics, and composite reinforcements without requiring primers.
Consistent reactivity with standard amine and anhydride hardeners, supporting reproducible processing.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace and automotive composites.
Matrix resin for filament-wound pressure vessels and fiber-reinforced laminates.
Insulating varnishes and coil coatings for electric motors and generators.
High-performance casting compounds for precision industrial components.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, low-viscosity liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–16,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, structural composites, high-performance adhesives |
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E-mail: wangxingqiang@ericwchem.com
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