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High molecular weight solid epoxy resin with excellent thermal stability and low melt viscosity.
Outstanding chemical resistance to acids, alkalis, and solvents after proper curing.
Provides superior mechanical strength and dimensional stability in cured formulations.
Compatible with a wide range of amine, anhydride, and phenolic hardeners for versatile cure systems.
Low extractables and minimal volatile organic content (VOC), supporting compliance with industrial safety standards.
Electrical encapsulation and potting compounds for transformers, reactors, and high-voltage components.
Structural adhesives for aerospace and automotive composite bonding.
High-performance powder coatings for metal substrates requiring corrosion and wear resistance.
Prepregs and laminates in printed circuit board (PCB) base materials.
Tooling resins for molds and master models used in composites manufacturing.
| Chemical Type | Bisphenol-A based solid epoxy resin |
| Product Form | Pale yellow to amber solid flakes or pellets |
| Epoxy Equivalent Weight (EEW) | 475–495 g/eq |
| Melt Viscosity (150 °C) | 8,000–12,000 cP |
| Softening Point | 82–88 °C |
| Chloride Content | ≤ 800 ppm |
| Volatiles (125 °C, 2 hrs) | ≤ 0.3 wt% |
| Primary Applications | Encapsulation, structural adhesives, powder coatings, prepregs |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
