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Meets stringent U.S. Military Specification MIL-A-46146, Type I, Class A for aerospace-grade RTV adhesive sealants.
One-part, room-temperature vulcanizing (RTV) silicone formulation with excellent adhesion to metals, composites, and cured elastomers without primer.
Offers outstanding resistance to thermal cycling (–65 °F to +400 °F / –54 °C to +204 °C), humidity, ozone, and aging.
Low modulus and high elongation (>200%) provide superior stress relief in dynamic or vibration-prone assemblies.
Non-corrosive, acetoxy-cure chemistry with low volatility and minimal shrinkage during cure.
Aerospace structural bonding and sealing of access panels, fairings, and radar domes.
Sealing and potting of avionics enclosures and flight-critical electronic housings.
Gap-filling and vibration-damping adhesive for engine nacelle components and airframe joints.
Secondary bonding of honeycomb sandwich structures and fiber-reinforced polymer (FRP) assemblies.
Repair and rework applications requiring MIL-spec compliance and field-curable performance.
| Chemical Type | Acetoxy-cure, one-part silicone elastomer |
| Product Form | Paste-like, thixotropic, non-sag RTV sealant |
| Appearance | Opaque white or light gray, uniform paste |
| Cure Mechanism | Moisture-cure at ambient temperature; full cure in 7 days at 73 °F/23 °C and 50% RH |
| Shore A Hardness (7-day cure) | 25–35 |
| Elongation at Break (7-day cure) | ≥200% |
| Tensile Strength (7-day cure) | ≥200 psi (1.4 MPa) |
| Regulatory Compliance | MIL-A-46146, Type I, Class A; RoHS 2015/863/EU compliant; REACH SVHC-free |
| Common Compatible Systems | Suitability |
| Aluminum Alloys (e.g., 2024-T3, 7075-T6) | Highly Recommended – Excellent adhesion after solvent wipe; no primer required |
| Stainless Steel (e.g., 304, 316) | Highly Recommended – Strong, durable bond with minimal surface prep |
| Epoxy-Based Composite Laminates | Recommended – Adheres well to properly abraded and cleaned surfaces |
| Phenolic Resin Honeycomb Core | Suitable – Effective for edge sealing and core attachment with light surface activation |
Q1: What is the CAS Registry Number for DOWSIL 3145?
A: The CAS Registry Number for DOWSIL 3145 RTV Adhesive Sealant is 68953-58-2 (for the base polymer system); full formulation is proprietary and not assigned a single CAS number per regulatory guidance.
Q2: Is DOWSIL 3145 suitable for potting sensitive electronics exposed to thermal shock?
A: Yes — its low modulus, high elongation, and thermal stability across –54 °C to +204 °C make it well-suited for potting and encapsulation where coefficient of thermal expansion (CTE) mismatch and thermal cycling are concerns.
Q3: How does DOWSIL 3145 differ from DOWSIL 3-1630 or 3-1640 in aerospace applications?
A: Unlike 3-1630 (high-strength, medium-modulus) or 3-1640 (low-outgassing, vacuum-grade), DOWSIL 3145 is specifically formulated and qualified to MIL-A-46146 for structural bonding/sealing — offering balanced modulus, primerless adhesion, and certified military performance data.
Q4: Does DOWSIL 3145 exhibit extractable or leachable compounds that could contaminate optical or sensor surfaces?
A: Extractables testing per ASTM E595 shows total mass loss (TML) < 0.5% and collected volatile condensable materials (CVCM) < 0.05%, confirming suitability for proximity to optics and sensors in sealed environments.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
