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High-performance, two-part addition-cure silicone elastomer offering excellent thermal stability and low compression set.
Exceptional adhesion to diverse substrates including metals, plastics, and glass without primers.
Low viscosity before cure enables precise dispensing and excellent flow for complex geometries and gap filling.
UL 94 V-0 rated for flame resistance, supporting safety-critical electronic encapsulation requirements.
Excellent electrical insulation properties with stable dielectric strength over wide temperature and humidity ranges.
Encapsulation and potting of power electronics, including IGBT modules and EV inverters.
Thermal interface material (TIM) bonding and stress-relieving underfill for high-power LED assemblies.
Sealing and protective coating for automotive sensors exposed to under-hood thermal cycling.
Die-attach and structural bonding in aerospace avionics housings requiring outgassing compliance.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-component liquid (Part A + Part B) |
| Appearance | Pale amber, translucent liquids (Part A and Part B) |
| Primary Applications | Encapsulation, potting, bonding, and thermal management in electronics |
| Key Features | Low compression set, UL 94 V-0, primerless adhesion, thermal stability to 200 °C |
| Benefits | Long-term reliability under thermal cycling, reduced assembly steps, improved moisture resistance |
| Cure System | Addition cure (no by-products) |
| Shelf Life (unopened, 25 °C) | 12 months from date of manufacture |
Q1: What is the typical cure mechanism for DOWSIL EA-9189 RTV Silicone?
A: DOWSIL EA-9189 is a one-component, moisture-curing RTV silicone that crosslinks at ambient temperature upon exposure to atmospheric humidity. Cure proceeds from the surface inward, with full depth cure dependent on part geometry, humidity, and temperature.
Q2: Is DOWSIL EA-9189 suitable for bonding or sealing in high-voltage electrical applications?
A: Yes — it is formulated to provide excellent dielectric strength, arc resistance, and long-term insulation performance, making it well-suited for encapsulation, potting, and sealing of transformers, sensors, and other high-voltage components.
Q3: How does temperature affect the handling and cure profile of this material?
A: Lower temperatures slow down moisture diffusion and extend both tack-free time and full cure duration, while higher temperatures accelerate cure — though prolonged exposure above 60 °C prior to full cure may impact final properties. Optimal application is typically between 15–30 °C and 40–60% RH.
Q4: Can DOWSIL EA-9189 be used in contact with food or potable water systems?
A: This product is not intended or certified for direct, continuous food contact or potable water applications. For such uses, consult Dow’s portfolio of FDA-compliant or NSF-listed silicones and request formal regulatory documentation.
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