High thermal stability up to 250 °C continuous service temperature.
Excellent electrical insulation properties with low dielectric loss.
Good compatibility with organic resins and inorganic fillers for hybrid formulations.
Low surface energy enabling superior release performance and hydrophobicity.
Solvent-based liquid format facilitating easy integration into coating and impregnation processes.
High-temperature insulating varnishes for electric motors and transformers.
Matrix resin for ceramic-filled composites used in aerospace thermal management components.
Binders in refractory coatings for industrial furnace linings.
Surface modifiers for glass fiber reinforcements in high-performance composites.
Base resin in flame-retardant, heat-resistant architectural sealants.
| Chemical Type | Methyl-phenyl silicone resin |
| Product Form | Liquid solution (toluene/xylene solvent system) |
| Appearance | Clear, colorless to pale yellow viscous liquid |
| Solids Content | 60 ± 2 wt% |
| Viscosity (25 °C, Brookfield LVT, spindle #3, 12 rpm) | 8,000–12,000 cP |
| Density (25 °C) | 0.94–0.97 g/cm³ |
| Flash Point (COC) | 42–48 °C |
| Key Features | Thermally stable, electrically insulating, hydrophobic, solvent-soluble |
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E-mail: wangxingqiang@ericwchem.com
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