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Ultra-soft, non-curing silicone putty with exceptional conformability to irregular surfaces and low interfacial resistance.
High thermal conductivity (1.5 W/m·K) enabling efficient heat transfer in low-compression or zero-clamp-force assemblies.
Wide operating temperature range from −60 °C to 200 °C for reliable performance in demanding thermal environments.
Non-slumping and tacky at room temperature — eliminates pump-out during thermal cycling and maintains stable interface contact.
Electrically insulating formulation with volume resistivity >1 × 10¹⁴ Ω·cm, supporting safe use on high-voltage components.
Thermal interface material (TIM) for power electronics modules including IGBTs, SiC MOSFETs, and battery management systems (BMS).
Heat dissipation in LED lighting arrays where minimal mechanical stress and long-term reliability are critical.
Thermal bridging between heat sinks and ASICs, GPUs, or FPGAs in compact 5G infrastructure and edge computing hardware.
Interface solution for automotive ADAS sensors, radar units, and onboard chargers requiring vibration resilience and thermal stability.
Gap-filling in aerospace avionics enclosures where outgassing compliance and low volatility are mandatory.
| Chemical Type | Filler-loaded, addition-cure silicone elastomer (platinum-catalyzed) |
| Product Form | Soft, moldable putty; supplied in sealed aluminum-laminated pouches |
| Appearance | Off-white to light gray, uniform paste with no visible grit or phase separation |
| Melting Point / Softening Range | No sharp melting point; gradual softening above 80 °C; remains dimensionally stable below 200 °C |
| Thermal Conductivity (ASTM D5470) | 1.5 W/m·K (at 25 °C, 50 psi interfacial pressure) |
| Volume Resistivity (ASTM D257) | >1 × 10¹⁴ Ω·cm |
| UL Recognition | UL 94 HB; certified per UL 746C for electrical insulation |
| Outgassing (NASA ASTM E595) | TC < 1.0%, CVCM < 0.1% — compliant for space-qualified applications |
| Common Compatible Systems | Suitability |
| Aluminum and copper heat sinks (anodized or bare) | Highly Recommended – Excellent adhesion and thermal contact without corrosion risk |
| Ceramic substrates (Al₂O₃, AlN, Si₃N₄) | Highly Recommended – Low interfacial resistance; no chemical incompatibility |
| Plastic housings (PPS, LCP, PEEK) | Recommended – Non-reactive; no stress cracking observed under standard conditions |
| FR-4 PCBs and polyimide flex circuits | Suitable – Electrically insulating; compatible with common solder mask chemistries |
Q1: What is the CAS Registry Number for DOWSIL TC-7004?
A: The CAS Registry Number for DOWSIL TC-7004 is 1365743-47-0.
Q2: What is the recommended application thickness and dispensing method?
A: Optimal bond line thickness is 0.1–0.5 mm. It can be applied manually (e.g., spatula), semi-automatically (pneumatic dispensing), or via automated jetting systems calibrated for medium-viscosity pastes.
Q3: How does TC-7004 compare to TC-5000 or TC-5500 series?
A: TC-7004 offers lower modulus and higher conformability than TC-5000/5500, making it ideal for ultra-low-clamp-force applications. Unlike those curable gels, TC-7004 remains permanently non-curing and reworkable.
Q4: Is TC-7004 compliant with RoHS 3 and REACH SVHC regulations?
A: Yes — TC-7004 is RoHS 3 (2015/863/EU) compliant and contains no substances on the current REACH SVHC Candidate List (as of Q2 2024).
Q5: Does TC-7004 exhibit extractables or migration under thermal aging?
A: No significant migration or extractables observed per IPC-TM-650 2.6.21 (solvent extraction) after 1000 hrs at 150 °C; filler stabilization prevents bleed-out.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
