English
Español
tiếng việt
русский
Ultra-low ionic residue profile optimized for post-CMP and wafer cleaning in advanced packaging and back-end-of-line (BEOL) processes.
Non-silicone, non-amine formulation designed to minimize particle redeposition and metal contamination risks on Cu, low-k dielectrics, and redistribution layers (RDL).
Highly effective at reducing surface tension without compromising rinse efficiency or leaving hydrophobic residues.
Compatible with deionized water-based chemistries and engineered for rapid drainability in spin-rinse and megasonic tool environments.
Stable across pH 4–8 and tolerant of typical process temperature fluctuations (15–40 °C).
Post-CMP cleaning for copper/low-k interconnect structures in advanced logic and memory devices.
Rinse aid in wafer-level packaging (WLP), fan-out wafer-level packaging (FOWLP), and 2.5D/3D IC assembly processes.
Surface conditioning prior to under-bump metallization (UBM) or solder bump formation.
Residue removal from redistribution layer (RDL) patterning and dielectric planarization steps.
Final rinse additive in single-wafer and batch-type wet processing tools for BEOL integration.
| Chemical Type | Nonionic surfactant blend (alkyl polyglucoside and modified ethoxylated alcohol) |
| Product Form | Clear, viscous liquid |
| Appearance | Colorless to pale yellow, homogeneous liquid |
| pH (1% aqueous solution, 25 °C) | 5.5 – 6.5 |
| Primary Applications | Back-end semiconductor cleaning, post-CMP rinse aid, BEOL residue management |
| Key Features | Low sodium/potassium content (<1 ppm), ultra-low chloride <5 ppb, non-volatile residue (NVR) <10 µg/cm² |
| Benefits | Reduces pattern collapse, improves drying uniformity, enables high-yield advanced packaging |
| Regulatory Compliance | REACH registered; RoHS 2 compliant; no SVHCs listed on ECHA Candidate List (as of latest update) |
| Common Compatible Systems | Suitability |
| DI Water-based spin-rinse-dry (SRD) tools | Highly Recommended – Designed for optimal performance in single-wafer SRD platforms |
| Megasonic-assisted cleaning systems (e.g., Modutek, Lam Research) | Highly Recommended – Stable under ultrasonic energy; enhances particle lift without cavitation damage |
| Acidic post-CMP slurries (e.g., dilute citric/H₂O₂ mixtures) | Recommended – Maintains surfactant integrity at pH ≥4; avoid strong oxidizers >500 ppm H₂O₂ |
| Alkaline rinse formulations (pH 7–8) | Suitable – Effective but monitor long-term stability above pH 8.0 |
Q1: What is the CAS Registry Number for Dow TRITON DF-15?
A: Dow TRITON DF-15 is a proprietary multi-component formulation; individual CAS numbers are not assigned to the final product. Component CAS numbers are available under NDA upon request via Dow Semiconductor Solutions technical support.
Q2: What is the recommended usage concentration range?
A: Typical working concentration is 0.01–0.10 wt% in deionized water, depending on tool configuration and process requirements. Optimization studies are advised for each application to balance residue control and drying performance.
Q3: How does TRITON DF-15 compare to TRITON DF-10 or DF-20 in BEOL applications?
A: DF-15 offers a balanced hydrophilicity-to-surface-energy ratio optimized for Cu/low-k compatibility—higher than DF-10 (designed for front-end) and lower foaming than DF-20 (optimized for thicker films). DF-15 delivers superior rinse uniformity on fine-pitch RDLs versus DF-10 and reduced NVR versus DF-20.
Q4: Is TRITON DF-15 subject to migration or leaching into dielectric layers during thermal cycling?
A: No measurable migration or leaching has been observed under standard BEOL thermal profiles (up to 250 °C for ≤60 min). Independent testing per JEDEC JESD22-A108 shows no detectable organic extractables from cured SiCOH or porous silica low-k films after DF-15 rinse and bake.
Q5: Does TRITON DF-15 meet SEMI S2/S8 safety and environmental requirements?
A: Yes. TRITON DF-15 meets SEMI S2 (health and safety) and S8 (environmental impact) guidelines for semiconductor manufacturing chemicals. Full Safety Data Sheet (SDS) and Environmental Profile Report are available through Dow’s secure customer portal.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
