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Uniform, pore-free metallic deposit with exceptional thickness control (±5% across complex geometries).
Self-catalyzing deposition process requiring no external electrical current — ideal for non-conductive substrates.
Superior corrosion resistance due to dense nickel-phosphorus underlayer (6–9 wt% P) combined with pure gold top layer (0.05–0.2 µm).
Excellent solderability and wire-bondability, maintaining low contact resistance (< 10 mΩ) after thermal aging.
RoHS-compliant formulation with no cyanide, lead, or cadmium in plating bath or final deposit.
Printed circuit board (PCB) edge connectors and gold fingers for high-reliability telecom and aerospace systems.
Semiconductor test probes, MEMS packaging, and flip-chip under-bump metallization (UBM).
Medical device components requiring biocompatible, non-allergenic, and sterilization-stable surface finishes.
Microwave and RF shielding enclosures where electromagnetic interference (EMI) suppression and signal integrity are critical.
High-precision optical and electro-optical housings demanding low outgassing and ultra-smooth surface finish (Ra < 0.1 µm).
| Chemical Type | Autocatalytic nickel-phosphorus plating bath followed by immersion gold displacement layer |
| Product Form | Liquid concentrate (nickel bath) + separate gold stabilizer solution (supplied as two-component kit) |
| Appearance (as deposited) | Smooth, bright, slightly warm-toned gold over matte nickel-phosphorus base |
| Typical Deposit Thickness Range | Ni-P: 2–8 µm; Au: 0.05–0.2 µm (adjustable per application requirements) |
| Primary Applications | ENIG (Electroless Nickel Immersion Gold) PCB finishing, UBM, precision connectors |
| Key Features | Non-magnetic, solderable, wire-bondable, low porosity, uniform coverage on recessed features |
| Benefits | Eliminates galvanic corrosion risk vs. electrolytic gold; enables fine-pitch component assembly; extends shelf life of bare copper pads |
| Regulatory Compliance | RoHS 2011/65/EU, REACH SVHC-free, IPC-4552A compliant, UL recognized (File E347207) |
| Common Compatible Systems | Suitability |
| Acidic nickel-phosphorus pre-plating baths (e.g., sodium hypophosphite-based) | Highly Recommended – Optimized pH (4.2–4.8) and temperature (85–95°C) ensure stable deposition kinetics |
| Immersion gold solutions (thiourea-free, low-acid formulations) | Highly Recommended – Designed for seamless integration; prevents nickel passivation and gold peeling |
| Acidic copper pre-treatment and micro-etch systems (H₂SO₄/H₂O₂ based) | Recommended – Requires strict rinse control to avoid residual oxidizers affecting nickel initiation |
| Alkaline cleaning and activation chemistries (e.g., palladium colloid activators) | Suitable – Validated for FR-4, polyimide, and ceramic substrates; requires post-activation DI rinse |
Q1: What is the CAS Registry Number for the Electroless Nickel Gold plating system?
A: The nickel-phosphorus bath component is registered under CAS No. 7440-02-0 (Nickel metal) and 7723-14-0 (Phosphorus); the immersion gold component falls under CAS No. 7440-57-5 (Gold metal). Full formulation-specific CAS numbers are provided in the Safety Data Sheet (SDS) Section 3.
Q2: How much ENIG solution is typically consumed per square meter of PCB surface area?
A: Average consumption is 80–120 mL/m² for nickel bath and 15–25 mL/m² for gold solution under standard IPC-4552A process conditions; actual usage depends on part geometry, immersion time, and bath loading.
Q3: How does Electroless Nickel Gold compare to Electrolytic Nickel Gold in terms of deposit uniformity and stress?
A: ENIG provides superior thickness uniformity (±5%) on complex shapes without edge buildup, while electrolytic processes exhibit higher current-density variation (±25–40%). ENIG deposits also demonstrate lower intrinsic stress (< 5 MPa) versus electrolytic gold (> 30 MPa), reducing microcrack risk during thermal cycling.
Q4: Are there restrictions on nickel ion migration or gold leaching in humid or saline environments?
A: Per IPC-TM-650 2.6.25 testing, ENIG deposits show < 0.02 ppm Ni migration and < 0.005 ppm Au leaching after 96h 85°C/85% RH exposure. Gold layer integrity prevents underlying nickel exposure, eliminating galvanic corrosion pathways in chloride environments.
Q5: Does this ENIG system meet IEC 61249-2-21 and JEDEC J-STD-003C for solderability and intermetallic formation?
A: Yes — validated per IEC 61249-2-21 (solder wettability > 95% after 168h aging at 155°C) and JEDEC J-STD-003C (intermetallic growth ≤ 0.3 µm after reflow; IMC composition confirmed as Ni₃Sn₄ with no brittle AuSn₄ phase detected).
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E-mail: wangxingqiang@ericwchem.com
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