Electronic Grade Copper Surface Cleaner

Features Of Electronic Grade Copper Surface Cleaner

1. Ultra-low ionic residue (<1.0 µg/cm² Na⁺, Cl⁻, SO₄²⁻) to prevent electrochemical migration in high-density interconnects.

2. Non-oxidizing, non-corrosive formulation specifically engineered for bare copper and copper-alloy surfaces without affecting underlying dielectrics.

3. Fast-drying, residue-free evaporation with no need for post-rinse in controlled cleanroom environments (Class 100 or better).

4. Compatible with automated spray, immersion, and vapor-phase cleaning equipment used in semiconductor backend and advanced packaging lines.

5. Stable across temperature range of 15–35°C; no phase separation or precipitation during extended storage.

Typical Applications Of Electronic Grade Copper Surface Cleaner

1. Cleaning of copper bond pads prior to wire bonding in IC assembly and power module manufacturing.

2. Surface preparation of copper traces on organic substrates (e.g., ABF, polyimide) before underfill dispensing or conformal coating.

3. Removal of light organic contaminants (e.g., fingerprint oils, flux residues, handling lubricants) from sputtered or electroplated Cu films.

4. Pre-encapsulation cleaning of copper leadframes and QFN packages to ensure adhesion integrity and long-term reliability.

5. Final surface conditioning of copper interconnects in MEMS and RF device packaging processes.

Specifications Of Electronic Grade Copper Surface Cleaner

Compatible Systems Of Electronic Grade Copper Surface Cleaner

Electronic Grade Copper Surface Cleaner – Frequently Asked Questions (FAQ)

Q1: What is the CAS Registry Number for this cleaner?

A: This is a proprietary multi-component formulation; individual components are disclosed under confidentiality agreement. Full composition is available upon execution of an NDA and submission of a regulatory inquiry to our Technical Support team.

Q2: What is the recommended usage concentration and dwell time for manual wipe cleaning?

A: For manual wipe application, use undiluted product with lint-free polyester wipes. Dwell time: 10–15 seconds contact time followed by immediate dry wipe; no rinse required. Avoid excessive saturation to prevent pooling on patterned surfaces.

Q3: How does this cleaner compare to traditional IPA-based or acetone-based cleaners for copper surfaces?

A: Unlike IPA (hygroscopic, high surface tension) or acetone (aggressive, high volatility), this cleaner offers lower surface tension (<22 mN/m), negligible water absorption, and no copper complexation—reducing risk of post-cleaning tarnish or interfacial delamination.

Q4: Has the cleaner been tested for extractables and leachables per USP <87> and <88>?

A: Yes — certified extractables testing performed per USP <87> (in vitro cytotoxicity) and USP <88> (implantation) using copper-coated stainless-steel coupons. Results show non-cytotoxic response (Grade 0–1) and no detectable elemental leaching (ICP-MS detection limit <0.1 ppb).

Q5: Does this product meet ISO 14644-1 Class 5 (ISO 5) airborne particle requirements when aerosolized?

A: When used in validated spray systems with HEPA-filtered exhaust, aerosolized mist meets ISO 14644-1 Class 5 for particles ≥0.5 µm. Particle generation testing conducted per IEST-RP-CC003.3 confirms <100 particles/ft³ at 1 ft from nozzle.