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Enhances cathode efficiency and improves current distribution for uniform metal deposition.
Delivers exceptional brightening and leveling performance in acid copper plating baths.
Stabilizes bath chemistry under high-current-density operating conditions.
Minimizes organic breakdown products, extending electrolyte service life.
Compatible with automated dosing systems and supports real-time process control.
PCB (Printed Circuit Board) through-hole and surface trace copper plating.
Electroplated copper undercoats for decorative chromium and nickel-chromium finishes.
High-reliability interconnects in semiconductor packaging substrates.
Copper plating of automotive sensor housings and precision connectors.
Functional copper layers in MEMS and microelectronics fabrication.
| Chemical Type | Sulfonated aromatic compound blend with proprietary synergists |
| Product Form | Aqueous liquid concentrate (non-volatile) |
| Appearance | Clear to slightly hazy amber liquid |
| pH (1% aqueous solution) | 5.8 – 6.4 at 25°C |
| Density (20°C) | 1.08 – 1.12 g/cm³ |
| Primary Applications | Acid copper electroplating (H₂SO₄/CuSO₄-based baths) |
| Key Features | Brightener, leveler, and ductility enhancer in one formulation |
| Regulatory Compliance | REACH SVHC-free; RoHS 3 compliant; no intentionally added PFAS |
| Common Compatible Systems | Suitability |
| Standard Acid Copper Sulfate Baths (e.g., Technic Cu-Bath, Atotech CUBRIT) | Highly Recommended – Optimized for standard operating parameters (50–250 g/L H₂SO₄, 20–25 g/L Cu²⁺) |
| High-Speed PCB Plating Lines (e.g., MacDermid Alpha SpeedFILM™) | Recommended – Requires minor adjustment of carrier/brightener ratio for optimal throwing power |
| Mixed-Additive Systems with Polyethylene Glycol (PEG) carriers | Suitable – Demonstrates stable interaction without precipitation or haze formation |
| Recycled Electrolytes with <5 ppm chloride | Recommended – Maintains performance stability with effective chloride scavenging |
Q1: What is the CAS Registry Number for Electroplating Additive 401?
A: Electroplating Additive 401 is a proprietary multi-component formulation; individual CAS numbers are not assigned to the final product. Component CAS numbers are available under NDA upon request.
Q2: What is the typical working concentration range in an acid copper bath?
A: Standard dosage is 0.5–2.0 mL/L, adjusted based on bath loading, temperature, and desired deposit properties; continuous monitoring via CVS (Cyclic Voltammetric Stripping) is recommended.
Q3: How does Additive 401 compare to conventional SPS/PEG/DPS systems?
A: Additive 401 integrates leveling and brightening functions into a single stabilized system, reducing additive interaction complexity and improving bath predictability versus traditional three-component approaches.
Q4: Is Electroplating Additive 401 compliant with food-contact or potable water regulations?
A: It is not intended for direct food-contact or potable water applications. Final plated parts must undergo full migration testing per FDA 21 CFR §175.300 or EU 10/2011 if used in regulated end-use environments.
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E-mail: wangxingqiang@ericwchem.com
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