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Enables ultra-uniform copper deposition across high-aspect-ratio interconnect features, minimizing topography variation.
Delivers exceptional micro-throwing power for void-free filling of sub-20 nm trenches and vias.
Stable performance under extended bath life and high-current-density plating conditions (≥25 A/dm²).
Low-additive-consumption formulation reduces replenishment frequency and operational cost.
Compatible with real-time in-line monitoring and automated dosing systems for fab-integrated process control.
Advanced logic and memory semiconductor manufacturing (e.g., FinFET, GAA transistor nodes).
Copper dual-damascene interconnect metallization for 7 nm, 5 nm, and 3 nm technology nodes.
High-performance packaging applications including 2.5D/3D IC integration and TSV plating.
Advanced substrate plating for high-bandwidth interposer and fan-out wafer-level packaging (FOWLP).
Research and development of next-generation interconnect materials and electrochemical deposition processes.
| Chemical Type | Sulfonated aromatic heterocyclic compound (non-sulfur-containing suppressor derivative) |
| Product Form | Aqueous solution (concentrated liquid) |
| Appearance | Clear, pale yellow to amber liquid |
| pH (1% aqueous solution) | 4.8 – 5.4 at 25 °C |
| Density (20 °C) | 1.08 – 1.12 g/cm³ |
| Primary Applications | Copper interconnect leveler in acid sulfate-based electrolytes |
| Key Features | Suppresses edge growth; enhances bottom-up fill uniformity; minimizes overburden |
| Regulatory Compliance | REACH SVHC-free; RoHS 3 compliant; no intentionally added PFAS |
| Common Compatible Systems | Suitability |
| Applied Materials SABRE™ / INOVA™ Plating Tools | Highly Recommended – Fully validated with standard Cu-Suppressor/AC Accelerator chemistries |
| Lam Research Altus® Max Platform | Highly Recommended – Integrated dosing and feedback control protocols pre-qualified |
| Technic Inc. Electra® Cu System | Recommended – Requires minor bath conditioning; compatible with Electra® 3000 series additives |
| Novellus / LAM Sabre® Legacy Platforms | Suitable – Functional with manual dosing; recommended for R&D and low-volume pilot lines |
Q1: What is the CAS Registry Number for this Leveler?
A: The CAS number is 2279465-88-1. This identifier corresponds to the proprietary active ingredient blend; full formulation details are protected under trade secret provisions.
Q2: What is the typical working concentration range in a copper sulfate plating bath?
A: Standard operating range is 0.5–2.0 mL/L, optimized per tool configuration and feature geometry. Initial qualification starts at 1.0 mL/L, with fine-tuning via cyclic voltammetric stripping (CVS) analysis.
Q3: How does this Leveler differ from conventional PEG-based or Janus Green B derivatives?
A: Unlike traditional suppressors, this Leveler exhibits selective adsorption kinetics—stronger binding at feature rims than at bottoms—enabling superior planarization without excessive inhibition. It also shows lower co-adsorption interference with chloride and accelerator species.
Q4: Is there data available on metal ion leaching or organic extractables into plating baths after prolonged use?
A: Yes—ICP-MS testing confirms <0.1 ppb Cu/Ni/Fe leaching from Leveler molecules after 72 h bath aging at 25 °C. No detectable organic extractables above 5 ppb by LC-MS/MS under standard operating conditions.
Q5: Does this product require special handling or storage conditions to maintain stability?
A: Store at 5–25 °C in original sealed container, protected from direct sunlight. Avoid freezing and prolonged exposure above 30 °C. Shelf life is 24 months unopened; 6 months after opening when maintained under nitrogen blanket.
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