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High-resolution patterning capability for sub-micron lithography processes.
Excellent thermal stability and post-exposure bake (PEB) latitude for robust process control.
Superior adhesion to silicon, glass, and metal substrates without additional primers.
Low outgassing profile suitable for vacuum and EUV-adjacent applications.
Consistent film-forming performance with low defect density after spin-coating.
MEMS device fabrication requiring high-aspect-ratio resist profiles.
Advanced packaging lithography including redistribution layer (RDL) patterning.
Micro-optoelectronic component manufacturing (e.g., waveguides, photonic ICs).
Sensor array production for automotive and industrial imaging systems.
Flexible electronics processing on polyimide and PET substrates.
| Chemical Type | Positive-tone chemically amplified photoresist (CAR) |
| Product Form | Liquid solution in proprietary solvent blend |
| Appearance | Clear, pale yellow liquid, free of visible particles |
| Primary Applications | i-line (365 nm) and deep UV (248 nm) lithography |
| Key Features | High sensitivity (~15 mJ/cm² at 248 nm), low line-edge roughness (LER < 4.5 nm) |
| Benefits | Enables high-throughput exposure with excellent process window and CD uniformity |
| Regulatory Compliance | REACH compliant; RoHS 3 (2015/863/EU) compliant; no SVHC above threshold |
| Storage Conditions | 2–8 °C in sealed container; protect from light and moisture |
| Common Compatible Systems | Suitability |
| Canon FPA-6300ES i-line stepper | Highly Recommended – Optimized exposure dose and focus latitude validated |
| Nikon NSR-S620D DUV scanner | Highly Recommended – Full process integration with standard track modules |
| Tokyo Electron CLEAN TRACK ACT 12 | Recommended – Verified compatibility with developer (TMAH 2.38%) and rinse modules |
| ASML PAS 5500/300 i-line aligner | Suitable – Requires minor adjustment of soft-bake and PEB profiles |
Q1: What is the CAS Registry Number for FujiFilm LTC 9305 Photoresist?
A: LTC 9305 is a proprietary multi-component formulation; individual components are covered under FujiFilm’s confidential CAS portfolio. The bulk product is assigned internal FujiFilm material ID #LTC9305-001 and is not assigned a single public CAS number.
Q2: What is the recommended coating thickness range and corresponding spin speed for 200 mm wafers?
A: For 1.2–1.4 µm dry film thickness on bare Si wafers, use 2500–3000 rpm for 30 seconds. Thickness may vary ±5% depending on ambient temperature (22±1°C) and humidity (40–50% RH).
Q3: How does LTC 9305 compare to FujiFilm’s older LTC 8700 series in terms of resolution and etch resistance?
A: LTC 9305 delivers ~30% higher resolution (down to 0.25 µm L/S vs. 0.35 µm for LTC 8700) and improved etch resistance due to enhanced polymer backbone rigidity—measured as 15% lower erosion rate in CF₄/O₂ plasma etch.
Q4: Are there any known extractables or leachables that require evaluation for medical device lithography use?
A: Extractables testing per USP <785> and ISO 10993-12 confirms no detectable low-MW acidic species (<0.1 ppm) or residual photoacid generator (PAG) fragments under simulated physiological conditions (PBS, 37°C, 72 h).
Q5: Does LTC 9305 meet halogen-free requirements per IEC 61249-2-21?
A: Yes — total chlorine and bromine content is <900 ppm (as measured by ASTM E2926-13 via combustion ion chromatography), satisfying “halogen-free” classification per IEC 61249-2-21.
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