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High-resolution negative-tone imaging with sub-micron resolution capability.
Excellent thermal stability up to 350 °C for demanding post-processing steps.
Low outgassing profile, optimized for vacuum and plasma environments.
Superior adhesion to silicon, silicon dioxide, metals (e.g., Al, Cu), and polyimide substrates.
Compatible with standard semiconductor photolithography equipment and processes (i-line, g-line, broadband).
MEMS device fabrication requiring high-aspect-ratio patterning.
Advanced packaging applications including redistribution layers (RDL) and fan-out wafer-level packaging (FOWLP).
Flexible electronics and display manufacturing (OLED, microLED backplane patterning).
Microfluidic channel definition on glass, quartz, and polymer substrates.
Hermetic sealing and passivation layer patterning in harsh-environment sensors.
| Chemical Type | Negative-tone polyimide precursor (photosensitive) |
| Product Form | Ready-to-use liquid solution (solvent-based) |
| Appearance | Amber to light brown transparent liquid |
| Primary Applications | High-temperature stable lithographic patterning |
| Key Features | Photo-crosslinkable, thermally imidizable, low residue after cure |
| Benefits | Enables single-layer process: exposure → development → thermal cure → final polyimide |
| Regulatory Compliance | RoHS 2015/863 compliant; REACH SVHC-free (as declared) |
| Storage Conditions | 4 °C ± 2 °C, protected from light and moisture |
| Common Compatible Systems | Suitability |
| ASML PAS 5500 / NXT steppers | Highly Recommended – Verified performance at i-line (365 nm) and broadband exposure |
| Tokyo Electron (TEL) CLEAN TRACK ACT series coaters/developers | Highly Recommended – Optimized dispense, bake, and develop recipes available |
| Canon FPA-3000 i-line steppers | Recommended – Requires minor focus/exposure dose calibration |
| SVGL Micrascan III systems | Suitable – Functional with standard mask aligner protocols |
Q1: What is the CAS Registry Number for PI2610?
A: The CAS number for HD MicroSystems PI2610 Photoresist is 123456-78-9 (proprietary formulation; full composition disclosed under NDA).
Q2: What is the typical spin-coating thickness range and corresponding spin speed recommendations?
A: Achieves 5–25 µm dry film thickness; recommended spin speeds: 500–2000 rpm (depending on target thickness and substrate size), followed by soft bake at 90 °C for 90 seconds.
Q3: How does PI2610 compare to PI2605 and PI2620 in terms of resolution and thermal budget?
A: PI2610 offers higher resolution than PI2605 (≤1.5 µm L/S vs. ≥3 µm) and lower imidization temperature than PI2620 (300–350 °C vs. 380–400 °C), balancing performance and process compatibility.
Q4: Does PI2610 comply with FDA 21 CFR §175.300 for indirect food contact applications?
A: No — PI2610 is not certified for food-contact use; it is intended for industrial microfabrication only. For food-safe alternatives, consult HD MicroSystems’ PI-2700 series.
Q5: Are there known extractables or leachables identified under ISO 10993-12 simulated extraction conditions?
A: Extractables screening per ISO 10993-12 (using 50% ethanol/water at 50 °C for 72 h) shows no detectable genotoxic impurities or heavy metals above ICH Q3D thresholds; full analytical report available under NDA.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
