Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KEY-DLS-H330 Direct Plate-making Photoresist

KEY-DLS-H330 Direct Plate-making Photoresist is a high-resolution, solvent-based negative photoresist from KEY’s DLS series, engineered for direct laser imaging (DLI) on aluminum printing plates. It delivers exceptional sensitivity, fine dot reproduction, and robust press durability—ideal for high-speed digital platemaking in commercial and packaging printing applications.
  • key dls h330 direct plate making photoresist_a53834d6
  • key dls h330 direct plate making photoresist_a53834d6

Features Of KEY-DLS-H330 Direct Plate-making Photoresist

  1. High-resolution imaging capability for sub-50 µm line/space patterns on metal and polymer-based printing plates.

  2. Optimized sensitivity to 405 nm LED exposure systems, enabling fast and energy-efficient plate processing.

  3. Excellent adhesion to aluminum, steel, and polyester substrates without requiring additional primers.

  4. Low development time in standard aqueous alkaline developers (e.g., 1–3% Na₂CO₃), reducing cycle time and wastewater load.

  5. Stable shelf life of ≥12 months when stored at 5–25 °C under inert atmosphere and light-protected conditions.

Typical Applications Of KEY-DLS-H330 Direct Plate-making Photoresist

  1. Direct laser imaging (DLI) of offset printing plates for commercial and packaging printing.

  2. Flexographic plate production for corrugated board and label applications requiring high edge acuity.

  3. Gravure cylinder pre-coating for proofing and short-run production workflows.

  4. Industrial screen printing stencil fabrication on stainless steel and nickel mesh substrates.

  5. Prototyping of functional micro-patterned surfaces in R&D labs for printed electronics substrates.

Specifications Of KEY-DLS-H330 Direct Plate-making Photoresist



Chemical TypeNovolac resin-based diazonaphthoquinone (DNQ) photoactive compound system
Product FormViscous liquid concentrate (solvent-based, ready-to-dilute)
AppearanceClear, amber-colored solution with no sediment or haze
Primary ApplicationsDirect plate-making for offset, flexo, gravure, and screen printing plates
Key FeaturesHigh photospeed, excellent resolution, thermal stability up to 120 °C (pre-bake), low outgassing
BenefitsReduced exposure energy, improved process window, compatibility with automated coaters and imagers
Regulatory ComplianceREACH compliant; RoHS 2015/863 Annex II (SVHC-free); non-PFAS formulation
Storage Conditions5–25 °C, sealed container, protected from UV light and moisture


Compatible Systems Of KEY-DLS-H330 Direct Plate-making Photoresist

Common Compatible SystemsSuitability
Kodak Magnus QX800 Series ImagersHighly Recommended – Optimized exposure dose profile and registration accuracy
Screen Trueflow 8000 DLP Imaging SystemsRecommended – Requires minor developer concentration adjustment for optimal contrast
Heidelberg HELIOTM 106 Direct Imaging UnitsHighly Recommended – Fully validated with standard bake and develop cycles
DU PONT Cyrel® FAST Processing LinesSuitable – Compatible with aqueous washout; may require extended rinse time
Custom-built LED-array imagers (405 ±5 nm)Recommended – Requires exposure calibration using step-wedge test charts

KEY-DLS-H330 Direct Plate-making Photoresist – Frequently Asked Questions (FAQ)

Q1: What is the CAS Registry Number for KEY-DLS-H330?

A: The CAS number for KEY-DLS-H330 is 1985732-88-1. This identifier applies to the formulated product as supplied; individual components have separate CAS entries available upon request under NDA.


Q2: What is the recommended coating thickness and solids content for optimal performance?

A: Apply at 12–15% w/w solids (diluted with recommended PGMEA or ethyl lactate) to achieve a dry film thickness of 1.8–2.2 µm after soft bake. Thickness outside this range may compromise resolution or adhesion.


Q3: How does KEY-DLS-H330 compare to KEY-DLS-H220 in terms of resolution and throughput?

A: KEY-DLS-H330 offers higher resolution (≤45 µm L/S vs. ≤60 µm for H220) and 25% faster exposure speed at 405 nm, but requires tighter process control. H220 remains preferred for high-speed, high-volume production where resolution >60 µm is acceptable.


Q4: Is KEY-DLS-H330 compliant with food-contact regulations for packaging applications?

A: Yes — fully compliant with EU Regulation (EC) No. 1935/2004 and FDA 21 CFR §175.105 for indirect food contact when fully cured (post-bake ≥110 °C for 10 min) and tested per EN 13130-1 for overall migration (≤10 mg/dm²).


Q5: Has migration or extractables testing been performed for pharmaceutical-grade plate applications?

A: Yes — certified extractables data (per ICH Q5C & USP <661.1>) is available for key leachables (DNQ derivatives, novolac fragments, solvent residuals) under standard curing conditions; full report provided with lot-specific CoA upon order.



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