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High-resolution photopatternability with sub-25 µm line/space definition under standard UV exposure (i-line, 365 nm).
Excellent thermal stability up to 220 °C post-cure, maintaining adhesion integrity in high-temperature processing environments.
Low outgassing profile (< 0.5% TML, < 0.1% CVCM per ASTM E595), suitable for vacuum and optical applications.
Single-component formulation requiring no mixing—ready-to-use after gentle agitation and filtration.
Compatible with aqueous alkaline development (0.1–0.5% NaOH or TMAH), enabling eco-friendly processing.
Wafer-level packaging (WLP) for MEMS and image sensors, including redistribution layer (RDL) bonding layers.
Temporary bonding/debonding in silicon carrier processes for thin-wafer handling and grinding.
Microfluidic device fabrication where precise channel definition and biocompatible surface retention are required.
Flexible printed electronics substrates, especially for copper-clad polyimide patterning and interconnect isolation.
Optoelectronic assembly, including LED chip attach and lens alignment layers requiring optical clarity and low birefringence.
| Chemical Type | Acrylated epoxy resin system with diazonaphthoquinone (DNQ) photoactive compound |
| Product Form | Viscous liquid (non-solvent-based) |
| Appearance | Amber-transparent, homogeneous liquid |
| Viscosity (25 °C) | 1,800 – 2,200 cP (Brookfield RV, spindle #3, 20 rpm) |
| Primary Applications | Photopatternable temporary bonding, RDL dielectric, microstructure encapsulation |
| Key Features | UV-sensitive, thermally stable, low ionic contamination (Na⁺/K⁺ < 5 ppm, Cl⁻ < 3 ppm) |
| Benefits | Process compatibility with standard semiconductor tools; minimal residue after plasma ashing |
| Regulatory Compliance | REACH SVHC-free; RoHS 2015/863 compliant; no intentionally added PFAS |
| Common Compatible Systems | Suitability |
| Canon FPA-3030i5a Stepper (i-line) | Highly Recommended – Optimized exposure dose: 120–160 mJ/cm² |
| Screen Printing & Spray Coating Equipment (e.g., Meyer Bar, Nordson ASYMTEK) | Recommended – Requires pre-filtering through 0.45 µm PTFE membrane |
| Oxford Plasma Systems (Plasma Ashing) | Highly Recommended – Full removal achieved at 150 W, 100 sccm O₂, 3 min |
| Standard Semiconductor Track Systems (e.g., Tokyo Electron CLEAN TRACK LITHIUS) | Suitable – Compatible with standard bake, expose, develop, and rinse modules |
Q1: What is the CAS Registry Number for HD-8900?
A: The CAS Registry Number for HD-8900 Photosensitive Adhesive is 2278934-77-1 (for the proprietary resin blend); individual components are listed in the full Safety Data Sheet (SDS).
Q2: What is the recommended coating thickness and corresponding spin speed for HD-8900?
A: For 8–12 µm dry film thickness, use spin coating at 2,500–3,000 rpm for 30 seconds on silicon wafers; thickness may vary slightly depending on substrate roughness and ambient humidity.
Q3: How does HD-8900 compare to conventional phenolic novolac/DNQ resists in terms of adhesion performance?
A: Unlike standard photoresists, HD-8900 is formulated as a functional adhesive — it provides >8 MPa shear adhesion strength to Si, SiO₂, and Cu after post-exposure bake, whereas traditional resists exhibit negligible cohesive/adhesive functionality.
Q4: Is HD-8900 compliant with food-contact or medical device regulations?
A: HD-8900 is not certified for direct food contact or implantable medical devices. It meets ISO 10993-5 (cytotoxicity) for short-term external contact use but requires customer-specific validation for regulated end-use applications.
Q5: Has migration or extractables testing been performed under typical process conditions?
A: Yes — LC-MS/MS testing per USP <87> and <88> shows no detectable leachables (< 0.1 ppm) from cured HD-8900 films exposed to IPA, DI water, and 0.1N HCl at 60 °C for 24 h.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
