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Low-viscosity liquid epoxy resin ideal for ambient or elevated temperature processing.
Excellent compatibility with standard amine and anhydride curing agents.
Provides high glass transition temperature (Tg) and thermal stability in cured systems.
Offers superior electrical insulation properties and moisture resistance.
Designed for consistent batch-to-batch performance and reliable formulation scalability.
Electrical encapsulation and potting compounds for transformers and sensors.
High-performance laminating resins for printed circuit board (PCB) substrates.
Structural adhesives requiring thermal and chemical resistance.
Composite matrix resins for aerospace and industrial tooling applications.
Coating systems for corrosion protection in demanding industrial environments.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chlorine Content | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | Stable ≥ 12 months at 20–25°C in sealed containers |
Q1: What is the primary function of HELoxy BD in epoxy formulations?
A: HELoxy BD is a reactive diluent designed to reduce viscosity and improve processability of epoxy resins without significantly compromising final crosslink density or thermal performance. It participates directly in the curing reaction, contributing to the polymer network.
Q2: Is HELoxy BD compatible with common amine and anhydride curing agents?
A: Yes, HELoxy BD exhibits good compatibility with a broad range of standard epoxy curing agents, including aliphatic and aromatic amines as well as cyclic anhydrides. Formulators should verify compatibility and cure kinetics under their specific processing conditions.
Q3: How does HELoxy BD compare to non-reactive diluents in terms of VOC and film properties?
A: As a reactive diluent, HELoxy BD becomes part of the cured polymer matrix, eliminating VOC emissions associated with solvent-based systems and avoiding the plasticization or leaching risks typical of non-reactive diluents. This supports higher solids content and improved chemical resistance in the final coating or composite.
Q4: Can HELoxy BD be used in high-performance composites or electrical encapsulation applications?
A: Yes, its low volatility, reactivity, and ability to maintain dielectric integrity make it suitable for demanding applications such as electrical potting compounds, laminates, and structural composites—particularly where low viscosity processing and high glass transition temperature are required.
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