English
Español
tiếng việt
русский
Low-viscosity liquid epoxy resin ideal for ambient or elevated temperature processing.
Excellent compatibility with standard amine and anhydride curing agents.
Provides high glass transition temperature (Tg) and thermal stability in cured systems.
Offers superior electrical insulation properties and moisture resistance.
Designed for consistent batch-to-batch performance and reliable formulation scalability.
Electrical encapsulation and potting compounds for transformers and sensors.
High-performance laminating resins for printed circuit board (PCB) substrates.
Structural adhesives requiring thermal and chemical resistance.
Composite matrix resins for aerospace and industrial tooling applications.
Coating systems for corrosion protection in demanding industrial environments.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 12–16 Pa·s (12,000–16,000 cP) |
| Chlorine Content | ≤ 700 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | Stable ≥ 12 months at 20–25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
