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High-purity bisphenol-A based liquid epoxy resin with low chloride content.
Excellent compatibility with a broad range of curing agents, including amines and anhydrides.
Low viscosity enables easy processing, impregnation, and mixing at ambient temperature.
Superior electrical insulation properties and high dielectric strength.
Good adhesion to metals, glass, and composite substrates after proper cure.
Electrical encapsulation and potting of transformers, reactors, and insulators.
Manufacturing of high-voltage composite insulators and bushings.
Matrix resin for filament-wound pressure vessels and structural composites.
Coating systems for corrosion protection in power transmission infrastructure.
Raw material for specialty laminates used in printed circuit board (PCB) prepregs.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Liquid |
| Appearance | Pale yellow, clear, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 1,000 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, composites, encapsulation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
