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Low-viscosity polyamide curing agent enabling excellent flow and wetting in epoxy systems.
Designed for ambient- and elevated-temperature cure profiles with good pot life control.
Provides enhanced flexibility and impact resistance in cured epoxy coatings and adhesives.
Offers improved chemical resistance, particularly to alkalis and solvents, in formulated systems.
Complies with REACH and meets low-VOC formulation requirements for industrial applications.
Industrial maintenance coatings for steel structures and offshore assets.
Epoxy flooring systems requiring toughness and abrasion resistance.
Structural adhesives for metal-to-metal and composite bonding.
Electrical encapsulation and potting compounds demanding thermal stability.
Marine anti-corrosive primers and topcoats for shipbuilding and repair.
| Chemical Type | Polyamide adduct |
| Product Form | Liquid |
| Appearance | Amber to light brown viscous liquid |
| Primary Applications | Epoxy coatings, adhesives, and composites |
| Key Features | Ambient-cure capability, low exotherm, flexible film formation |
| Benefits | Improved intercoat adhesion, reduced cracking, extended working time |
| Storage Stability | 12 months in unopened original container at 20–25°C |
| Handling Precautions | Refer to Safety Data Sheet (SDS); use appropriate PPE |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
