KEY-288 Silver Oxide Cleaning Agent

Features Of KEY-288 Silver Oxide Cleaning Agent

1. Non-corrosive formulation specifically engineered to remove silver oxide residues without attacking underlying silver, copper, or palladium metallization.

2. pH-neutral (6.8–7.2) aqueous solution ensures compatibility with sensitive electronic components and solder masks.

3. Rapid dissolution kinetics—achieves >95% silver oxide removal within 60–120 seconds at ambient temperature (20–25°C).

4. Low-VOC, non-halogenated chemistry compliant with IPC-J-STD-033 and RoHS 3 (EU Directive 2015/863) requirements.

5. Leaves no ionic residue; passes IPC-TM-650 2.3.25 surface insulation resistance (SIR) testing after rinsing and drying.

Typical Applications Of KEY-288 Silver Oxide Cleaning Agent

1. Cleaning silver-plated contacts and switch contacts in automotive sensors and relay assemblies.

2. Post-reflow cleaning of Ag-filled conductive adhesives and silver paste residues on hybrid microcircuits.

3. Removal of tarnish and oxidation from silver-based bonding wires and die-attach pads in power semiconductor modules.

4. Maintenance cleaning of silver-coated RF shielding gaskets and EMI suppression components.

5. Pre-encapsulation surface preparation for silver-metallized ceramic substrates in high-reliability aerospace electronics.

Specifications Of KEY-288 Silver Oxide Cleaning Agent

Compatible Systems Of KEY-288 Silver Oxide Cleaning Agent

KEY-288 Silver Oxide Cleaning Agent – Frequently Asked Questions (FAQ)

Q1: What is the CAS Registry Number for KEY-288?

A: KEY-288 is a proprietary multi-component formulation; individual ingredients are disclosed under confidentiality and do not carry a single CAS number. Full ingredient disclosure is available under signed CDA per customer request.

Q2: What is the recommended contact time and temperature range for optimal performance?

A: For most applications, 90 seconds at 20–25°C (ambient) is sufficient. At elevated temperatures (35–45°C), contact time may be reduced to 45 seconds—however, prolonged exposure (>180 sec) above 45°C is not advised to prevent potential surfactant film formation.

Q3: How does KEY-288 compare to traditional nitric acid or sodium persulfate cleaners?

A: Unlike aggressive oxidizers (e.g., HNO₃) or strong salts (Na₂S₂O₈), KEY-288 operates via selective chelation—preserving base metal integrity, eliminating hydrogen embrittlement risk, and avoiding hazardous fumes or heavy metal waste streams.

Q4: Does KEY-288 meet IPC-CC-830B for electrical insulation properties after cleaning?

A: Yes—when used per instructions and followed by DI water rinse (≥2 min) and forced-air drying (60°C, 10 min), KEY-288-treated surfaces consistently achieve ≥100 MΩ insulation resistance per IPC-CC-830B Section 4.3.2.

Q5: Is there any risk of silver ion migration or leaching into adjacent dielectrics after cleaning?

A: No—KEY-288 contains no free halides or complexing agents that promote Ag⁺ mobility. Independent ion chromatography testing confirms <0.05 ppm residual silver in final rinse water, well below JEDEC JESD22-A108F migration thresholds.