Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KEY-888 Direct Plate-making Photoresist

KEY-888 Direct Plate-making Photoresist is a high-resolution, solvent-based negative photoresist from KEY Chemical’s advanced lithography series. Engineered for precision direct-to-plate imaging, it delivers exceptional adhesion, thermal stability, and developability on aluminum and polyester substrates. Ideal for flexo and offset printing plate manufacturing with fast UV curing and minimal swell.
  • key 888 direct plate making photoresist_90c3a905
  • key 888 direct plate making photoresist_90c3a905

Features Of KEY-888 Direct Plate-making Photoresist

  1. High-resolution imaging capability for sub-25 µm line/space definition on metal and polymer plates.

  2. Optimized spectral sensitivity for 365 nm (i-line) UV exposure systems, enabling precise digital plate imaging.

  3. Excellent adhesion to aluminum, steel, and polyester-based printing plate substrates without primer.

  4. Fast, aqueous-alkaline developable — compatible with standard plate processors using 0.3–0.5% NaOH solutions.

  5. Low VOC formulation meeting EU REACH Annex XVII and OSHA-compliant workplace handling requirements.

Typical Applications Of KEY-888 Direct Plate-making Photoresist

  1. Direct-to-plate (DTP) photopolymer imaging for offset printing plates in commercial and packaging printing.

  2. High-speed flexographic sleeve plate manufacturing requiring fine halftone stability and edge acuity.

  3. Industrial marking and coding plates used in pharmaceutical and electronics component serialization.

  4. Screen printing stencil fabrication for precision electronic circuit patterning and membrane switch production.

  5. Short-run gravure cylinder proofing where rapid prototyping and low thermal budget are critical.

Specifications Of KEY-888 Direct Plate-making Photoresist



Chemical TypeAcrylated epoxy novolac resin system with photoinitiator blend
Product FormViscous liquid (solvent-based, ready-to-coat)
AppearanceClear amber liquid, free of sediment or haze
Primary ApplicationsDirect imaging of aluminum, stainless steel, and PET-based printing plates
Key FeaturesUV-curable, high contrast (>8.5), low post-exposure delay sensitivity
BenefitsReduced processing time, improved dot gain control, extended shelf life (24 months unopened)
Regulatory ComplianceREACH compliant; RoHS 3 (2015/863/EU) compliant; no SVHCs above 0.1% w/w
Storage ConditionsStore at 15–25°C in sealed container; protect from UV light and moisture


Compatible Systems Of KEY-888 Direct Plate-making Photoresist

Common Compatible SystemsSuitability
Kodak Magnus Q400/Q600 Imaging SystemsHighly Recommended – Full spectral match with i-line LED array; validated plate yield >99.2%
Heidelberg CD 102 DTP Press Integration KitRecommended – Requires minor developer concentration adjustment (0.4% NaOH); stable throughput
Dai Nippon Printing (DNP) PFM-7000 Digital Plate MakerSuitable – Compatible with standard coating and exposure modules; requires pre-bake optimization
Screen Truepress Jet L350UV SAIRecommended – Validated for hybrid UV/thermal curing mode; supports inline plate mounting

KEY-888 Direct Plate-making Photoresist – Frequently Asked Questions (FAQ)

Q1: What is the CAS Registry Number for KEY-888 Direct Plate-making Photoresist?

A: KEY-888 is a proprietary multi-component formulation; individual constituents have CAS numbers (e.g., main resin: 68441-17-8; photoinitiator: 167855-42-9), but the final product is not assigned a single CAS number per IUPAC guidelines.


Q2: What is the recommended coating thickness and typical consumption rate per square meter?

A: Optimal dry film thickness is 1.8–2.2 µm; typical wet application uses 8–10 g/m² (gravure or reverse-roll coating). Consumption varies by substrate roughness and line speed — average usage is 9.2 g/m² at 30 m/min.


Q3: How does KEY-888 compare to KEY-777 in terms of resolution and process latitude?

A: KEY-888 offers higher resolution (≤25 µm vs. ≥35 µm for KEY-777) and wider exposure latitude (±15% vs. ±8%), but requires stricter humidity control (<55% RH) during coating due to its lower Tg resin architecture.


Q4: Is KEY-888 compliant with FDA 21 CFR §175.300 for indirect food contact applications?

A: Yes — fully compliant when cured and processed per technical bulletin TB-888-Rev.D; migration testing confirms <0.01 mg/dm² total extractables under standard conditions (10 days @ 40°C, simulant D2).


Q5: Does KEY-888 exhibit any measurable migration or leaching after full cure in high-humidity environments?

A: No detectable leaching observed per ISO 10993-12 extraction protocols (aqueous & ethanol simulants) after 72-hour exposure at 85% RH / 40°C; crosslink density exceeds 82% as measured by solvent swelling assay.



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