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High-resolution negative-tone photoresist with excellent pattern fidelity down to sub-micron features.
Low shrinkage and high thermal stability (up to 200 °C post-bake), enabling robust MEMS and microfluidic device fabrication.
Optimized viscosity (≈1.7 cP at 25 °C) for uniform spin-coating on silicon, glass, and metal substrates.
Deep UV (i-line, 365 nm) sensitivity with high photospeed and wide process latitude.
Excellent chemical resistance to common etchants including BOE, TMAH, and plasma ashing processes.
Microelectromechanical systems (MEMS) structural layers and sacrificial templates.
Lab-on-a-chip and microfluidic channel fabrication.
High-aspect-ratio photolithography for micro-optics and diffractive elements.
Wafer-level packaging and redistribution layer (RDL) patterning.
3D microfabrication via multi-layer lithography and grayscale exposure techniques.
| Chemical Type | Epoxy-based negative-tone photoresist |
| Product Form | Ready-to-use liquid solution in gamma-butyrolactone (GBL) |
| Appearance | Clear, pale yellow liquid, free of particulates |
| Viscosity (25 °C) | 1.6–1.8 cP |
| Primary Applications | Micropatterning for MEMS, microfluidics, and micro-optics |
| Key Features | Negative-tone, high resolution, low outgassing, solvent-developable |
| Benefits | Minimal swelling during development, high aspect ratio capability, excellent adhesion to Si/SiO₂/Cr/Au |
| Regulatory Compliance | REACH compliant; RoHS 2015/863 Annex II compliant; no SVHCs above threshold |
| Common Compatible Systems | Suitability |
| Mask Aligners (e.g., Karl Suss MA6, EVG620) | Highly Recommended – Optimized for i-line (365 nm) exposure with standard quartz masks |
| Spin Coaters (e.g., Laurell WS-400B-6NPP/LAB, Headway EC301) | Highly Recommended – Precise thickness control (1.5–2.5 µm @ 2000–4000 rpm) |
| Hot Plates & Vacuum Bake Systems (e.g., Novoceram ST-200, Tempress 1000) | Recommended – Compatible with soft bake (65 °C), post-exposure bake (95 °C), and hard bake (150–200 °C) |
| Developer Systems (e.g., TechniClean CD-2000, NMD-3) | Suitable – Fully compatible with standard SU-8 developers (e.g., mr-Dev 600, Microposit PGMEA) |
Q1: What is the CAS Registry Number for SU-8 2005?
A: The CAS number for MicroChem SU-8 2005 is 137417-77-3 (as assigned to the proprietary epoxy resin formulation). Note that full composition is proprietary and not disclosed under TSCA or REACH confidentiality provisions.
Q2: What is the typical consumption rate per 100 mm wafer at 2.0 µm thickness?
A: Approximately 0.8–1.2 mL per 100 mm wafer (depending on spin speed, acceleration, and edge-bead removal protocol). A 100 mL bottle supports ~100–120 wafers under standard processing conditions.
Q3: How does SU-8 2005 differ from SU-8 2000.5 or SU-8 2075 in terms of resolution and process window?
A: SU-8 2005 offers higher resolution (≥0.8 µm L/S) and narrower linewidth variation vs. SU-8 2000.5 (≥2.0 µm), while maintaining broader PEB temperature latitude than SU-8 2075. It balances resolution, throughput, and process robustness for R&D and pilot-line use.
Q4: Is SU-8 2005 compliant with ISO 10993 or USP Class VI for biomedical device applications?
A: SU-8 2005 is not certified to ISO 10993 or USP Class VI. While widely used in research-grade microfluidic devices, end-use biocompatibility requires user-conducted extractables testing per ISO 10993-12 and material-specific cytotoxicity assessment.
Q5: Are there known migration or leaching concerns when SU-8 2005 is exposed to aqueous buffers or cell culture media?
A: Fully crosslinked SU-8 2005 shows minimal leaching (<0.1 µg/cm²) in PBS and DMEM after 72 h at 37 °C, per MicroChem’s internal extraction studies (LC-MS/MS). Residual monomer and incomplete crosslinking significantly increase extractables — strict adherence to recommended PEB time/temperature is critical.
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E-mail: wangxingqiang@ericwchem.com
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