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High-resolution imaging capability with sub-micron pattern fidelity on copper, aluminum, and stainless steel substrates.
Water-developable formulation eliminates need for hazardous organic solvents during processing.
Excellent thermal stability up to 130 °C, enabling robust post-exposure bake (PEB) and plating compatibility.
Low viscosity emulsion (18–22 cP at 25 °C) ensures uniform coating via spin, spray, or curtain coating methods.
UV-sensitive diazonaphthoquinone (DNQ)-novolac chemistry provides high contrast and rapid photoreaction under i-line (365 nm) exposure.
Printed circuit board (PCB) inner-layer and outer-layer imaging for fine-line etching.
Flexible circuit fabrication using polyimide and PET substrates.
Electroplating mask production for MEMS and microfluidic device patterning.
Industrial metal nameplate and decorative trim etching in automotive and appliance manufacturing.
Stencil and screen printing plate preparation for high-precision conductive paste deposition.
| Chemical Type | Diazonaphthoquinone (DNQ)-novolac photoresist emulsion |
| Product Form | Aqueous emulsion, ready-to-use liquid |
| Appearance | Opaque off-white to light beige, homogeneous liquid |
| pH (25 °C) | 8.2–8.7 |
| Solids Content | 28–32 wt% (by gravimetric analysis) |
| Primary Applications | Photolithographic patterning for etching and plating masks |
| Key Features | Water-developable, i-line sensitive, low halogen content |
| Regulatory Compliance | RoHS 2015/863 compliant; REACH SVHC-free (as per latest candidate list) |
| Common Compatible Systems | Suitability |
| ORC® UV Exposure Systems (e.g., ORC 4000 series) | Highly Recommended – Optimized spectral output matches i-line sensitivity peak |
| Screen Print Coaters (e.g., DEK Horizon, MPM AccuFlex) | Recommended – Adjustable viscosity supports consistent mesh transfer |
| Conveyorized Spray Coaters (e.g., Nordson ASYMTEK Select Coat) | Recommended – Stable emulsion resists nozzle clogging under standard filtration (≥50 μm) |
| Automated Development Lines (e.g., Semitool ECD-200) | Suitable – Compatible with 0.2–0.5% Na₂CO₃ aqueous developer at 25–30 °C |
Q1: What is the CAS Registry Number for KEY-Sliver 6# Photoresist Emulsion?
A: KEY-Sliver 6# is a proprietary multi-component formulation; individual CAS numbers are assigned to key constituents only (e.g., DNQ sensitizer: 2291-39-2; novolac resin blend: 9003-36-5). Full formulation CAS is not assigned per IUPAC guidelines for mixtures.
Q2: What is the recommended coating thickness and corresponding spin speed range for optimal resolution?
A: For 8–12 μm dry film thickness (DFT), use spin coating at 1,200–2,000 rpm for 30 seconds on clean, hydrophobic substrates. Thickness may vary ±15% depending on substrate surface energy and ambient humidity (40–60% RH recommended).
Q3: How does KEY-Sliver 6# compare to conventional solvent-based photoresists in terms of environmental impact and workplace safety?
A: Unlike solvent-based resists, KEY-Sliver 6# contains no VOCs, xylene, PGMEA, or NMP—reducing inhalation hazards, eliminating explosion risk, and simplifying waste water treatment. OSHA PEL and ACGIH TLV thresholds do not apply to its aqueous matrix.
Q4: Are there documented migration or leaching studies for use in food-contact or medical device applications?
A: KEY-Sliver 6# is not certified for direct food-contact or implantable medical devices. Migration testing per ISO 10993-12 shows <0.1 ppm total organic extractables in aqueous simulants (10% ethanol, pH 3.0 buffer) under standard curing conditions; however, it is not intended for regulated biocompatibility applications.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
