Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SMB-360 Epoxy Resin

KUKDO SMB-360 Epoxy Resin is a high-performance bisphenol-A-based liquid epoxy resin offering excellent adhesion thermal stability and chemical resistance ideal for composites coatings and electrical encapsulation applications widely used in aerospace automotive and electronics industries.
  • kukdo smb 360 epoxy resin_d63c32a2
  • kukdo smb 360 epoxy resin_d63c32a2

Features Of KUKDO SMB-360 Epoxy Resin

  1. High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.

  2. Excellent chemical resistance to alkalis, dilute acids, and solvents after full curing.

  3. Low viscosity (4,500–5,500 cP at 25°C) enabling easy processing, impregnation, and air release.

  4. Superior electrical insulation properties with high dielectric strength and volume resistivity.

  5. Good adhesion to metals, glass, and composite substrates without primer requirement.

Typical Applications Of KUKDO SMB-360 Epoxy Resin

  1. Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.

  2. Structural adhesive formulation for aerospace and automotive bonding applications.

  3. Matrix resin for filament-wound composite pressure vessels and tanks.

  4. Coating systems for corrosion protection of steel infrastructure in marine and industrial environments.

  5. Prepreg and infusion resins for wind turbine blade manufacturing.

Specifications Of KUKDO SMB-360 Epoxy Resin

Chemical TypeBisphenol-A based liquid epoxy resin
Product FormClear, low-viscosity liquid
AppearancePale yellow to water-white, transparent
Epoxy Equivalent Weight (EEW)182–188 g/eq
Viscosity (25°C)4,500–5,500 cP
Chloride Content< 800 ppm
Volatiles (by weight)< 0.3%
Storage Stability12 months at < 25°C in sealed containers


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