English
Español
tiếng việt
русский
High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy handling, mixing, and processing in industrial equipment.
Superior electrical insulation properties and low dielectric loss suitable for electronic encapsulation.
Good thermal stability and adhesion to metals, glass, and composite substrates after cure.
Electrical & electronic encapsulants and potting compounds.
Structural adhesives for aerospace and automotive bonding.
Composite matrix resin for fiber-reinforced laminates (e.g., carbon/glass fiber).
High-performance coatings for corrosion-resistant industrial linings.
Wind turbine blade bonding and structural reinforcement systems.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, amber-colored liquid |
| Appearance | Homogeneous, transparent, slightly viscous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chlorine Content | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at <25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
