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High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (10,000–14,000 cP at 25°C) enabling easy handling, mixing, and impregnation.
Superior electrical insulation properties and thermal stability up to 130°C (UL RTI rating).
Low chloride content (<500 ppm), supporting high-reliability applications in electronics and composites.
Electrical encapsulation and potting of transformers, reactors, and power modules.
Structural adhesives for aerospace and automotive bonding where thermal and chemical resistance are critical.
Matrix resin in filament-wound composite pressure vessels and piping systems.
Laminating resin for high-performance printed circuit board (PCB) prepregs and base materials.
Coating formulations for corrosion-resistant industrial tank linings and marine infrastructure.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid without sediment or haze |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Storage Stability | ≥ 12 months at <25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
