MicroChem SU-8 2010 Photoresist

Features Of MicroChem SU-8 2010 Photoresist

1. High-resolution negative-tone photoresist with sub-micron lithographic capability (down to 0.5 µm lines/spaces).

2. Excellent thermal stability and chemical resistance post-bake—stable up to 200 °C in inert atmosphere.

3. Low outgassing formulation suitable for vacuum-compatible MEMS and microfluidic device fabrication.

4. Optimized viscosity (~10–12 cP at 25 °C) for uniform spin-coating on silicon, glass, and metal substrates.

5. UV-sensitive epoxy-based chemistry with high crosslinking density upon 365 nm (i-line) exposure.

Typical Applications Of MicroChem SU-8 2010 Photoresist

1. MEMS structural layers and sacrificial mold fabrication for LIGA-like processes.

2. Microfluidic channel definition in lab-on-a-chip (LOC) devices and biomedical sensors.

3. High-aspect-ratio photolithography for micro-optics, diffractive elements, and waveguide patterning.

4. Stencils and etch masks for deep reactive ion etching (DRIE) of silicon and fused silica.

5. Permanent passivation and encapsulation layers in harsh-environment electronic packaging.

Specifications Of MicroChem SU-8 2010 Photoresist

Compatible Systems Of MicroChem SU-8 2010 Photoresist

MicroChem SU-8 2010 Photoresist – Frequently Asked Questions (FAQ)

Q1: What is the CAS number for SU-8 2010?

A: SU-8 2010 is a proprietary multi-component formulation; therefore, it does not have a single CAS number. Individual constituents (e.g., EPON SU-8 resin, triarylsulfonium salt photoinitiator, GBL solvent) are listed with their respective CAS numbers in the Safety Data Sheet (SDS Section 3).

Q2: How much SU-8 2010 is typically consumed per 100 mm wafer at 10 µm thickness?

A: Approximately 0.8–1.2 mL per 100 mm wafer for a nominal 10 µm film thickness using standard spin parameters (500 rpm for 5 s, then 2000 rpm for 30 s). Actual consumption depends on substrate roughness, edge bead removal, and coater efficiency.

Q3: How does SU-8 2010 compare to SU-8 2002 or SU-8 2075 in terms of resolution and aspect ratio?

A: SU-8 2010 offers higher resolution than SU-8 2002 (designed for thicker films >20 µm) and lower viscosity than SU-8 2075, enabling finer features (≤0.5 µm) and smoother sidewalls. It achieves higher aspect ratios than 2002 at equivalent thicknesses due to optimized crosslinker concentration and reduced scattering.

Q4: Is SU-8 2010 compliant with ISO 10993 for biocompatibility testing?

A: SU-8 2010 itself is not certified to ISO 10993. However, peer-reviewed literature demonstrates successful use in Class IIa medical devices after full curing (post-exposure bake ≥120 °C for 1 h) and rigorous extraction protocols. Users must validate biocompatibility per their specific device configuration and intended use.

Q5: Are there known leachables or extractables from cured SU-8 2010 in aqueous or physiological media?

A: Fully cured SU-8 2010 (≥120 °C for 1 h) shows negligible extractables in USP <661.1> Class VI testing and ISO 10993-12 simulated body fluid assays. Residual photoinitiator (<0.1 wt%) may be detected in aggressive solvents (e.g., DMSO) if under-cured; strict adherence to recommended PEB is essential.