MicroChem SU-8 2100 Photoresist

Features Of MicroChem SU-8 2100 Photoresist

1. High-resolution negative-tone photoresist with excellent pattern fidelity down to sub-micron features.

2. Deep UV (i-line, 365 nm) and broad-band exposure compatibility for standard lithography tools.

3. Superior thermal stability and chemical resistance after post-exposure bake (PEB) and development.

4. Low outgassing and minimal shrinkage during curing—ideal for high-aspect-ratio MEMS and microfluidic structures.

5. Consistent viscosity and shelf-stable formulation enabling reliable spin-coating performance across wafer sizes up to 200 mm.

Typical Applications Of MicroChem SU-8 2100 Photoresist

1. Microelectromechanical systems (MEMS) fabrication including accelerometers, gyroscopes, and pressure sensors.

2. Microfluidic device patterning for lab-on-a-chip (LOC) platforms and biomedical diagnostics.

3. 3D microstructures for optical waveguides, diffractive optics, and micro-lens arrays.

4. Stencils and shadow masks for electroplating and lift-off processes in advanced packaging.

5. Permanent passivation layers and etch masks in semiconductor and compound semiconductor processing.

Specifications Of MicroChem SU-8 2100 Photoresist

Compatible Systems Of MicroChem SU-8 2100 Photoresist

MicroChem SU-8 2100 Photoresist – Frequently Asked Questions (FAQ)

Q1: What is the CAS Registry Number for SU-8 2100?

A: The CAS number for MicroChem SU-8 2100 Photoresist is 137977-01-2 (for the formulated product). Individual components have separate CAS numbers listed in the Safety Data Sheet (SDS).

Q2: How much SU-8 2100 is typically required per 100 mm wafer at 10 µm thickness?

A: Approximately 1.2–1.5 mL per 100 mm wafer is recommended for a nominal 10 µm film thickness using standard spin parameters (e.g., 500 rpm for 10 s, then 2000 rpm for 30 s); actual volume depends on substrate porosity and edge bead removal settings.

Q3: How does SU-8 2100 differ from SU-8 2000 series variants (e.g., SU-8 2005 or SU-8 2075)?

A: SU-8 2100 offers higher viscosity and optimized crosslink density for thicker films (5–100 µm) and enhanced mechanical robustness versus lower-viscosity grades; it also features improved shelf life and reduced particulate generation compared to earlier formulations.

Q4: Is SU-8 2100 suitable for medical device applications requiring biocompatibility testing?

A: SU-8 2100 is not ISO 10993-certified as supplied; however, fully cured films have demonstrated low cytotoxicity in preliminary extractables studies. Device-level biocompatibility validation (e.g., USP <87>, ISO 10993-5/-12) must be performed by the end user under intended use conditions.

Q5: Are there known leachables or extractables from cured SU-8 2100 in aqueous or buffered environments?

A: Fully cured SU-8 2100 exhibits negligible leachables in neutral aqueous media at room temperature; trace residual photoinitiator (TPS) may be detected under aggressive extraction (e.g., 72 h in PBS at 60°C), but remains well below ICH Q3C limits when processed per MicroChem’s recommended PEB and hard bake protocol.