Ultra-high purity nickel (≥99.999% Ni), minimizing trace-element interference in sensitive crystal growth and research applications.
Single-crystal structure with controlled orientation (e.g., <100>, <110>, or <111> axial alignment), ensuring anisotropic mechanical and thermal consistency.
Exceptional dimensional stability under ultra-high vacuum (UHV) and elevated temperature conditions (up to 1200 °C).
Low dislocation density (<10² cm⁻²) and absence of grain boundaries, critical for epitaxial substrate preparation and surface science studies.
Electropolished surface finish (Ra < 0.05 µm) with minimal native oxide contamination, ready for UHV chamber loading without additional cleaning.
Substrate material for molecular beam epitaxy (MBE) and physical vapor deposition (PVD) of magnetic thin films and spintronic heterostructures.
Reference standard in high-resolution X-ray diffraction (HR-XRD) and low-energy electron diffraction (LEED) calibration.
Catalyst support and model surface in fundamental heterogeneous catalysis research (e.g., CO oxidation, hydrogenation kinetics).
Target material for sputtering and ion beam etching in semiconductor process development.
Thermal management component in cryogenic scanning probe microscopy (SPM) stages requiring zero thermal expansion mismatch.
| Chemical Type | Nickel (Ni), single crystal |
| Product Form | Rectangular block (custom dimensions available; standard: 10 mm × 10 mm × 2 mm) |
| Crystal Orientation | Specified per order: <100>, <110>, or <111> ± 0.5° |
| Appearance | Uniform metallic luster; electropolished, mirror-like surface |
| Melting Point | 1455 °C (bulk Ni reference value) |
| Primary Applications | Surface science, thin-film deposition, catalysis modeling, UHV instrumentation |
| Key Features | Single-domain structure, low defect density, certified crystallographic orientation |
| Regulatory Compliance | RoHS-compliant; REACH SVHC-free; no intentional addition of cobalt, chromium, or iron |
| Common Compatible Systems | Suitability |
| Ultra-High Vacuum (UHV) Surface Analysis Chambers (e.g., SPECS, Omicron) | Highly Recommended – Designed for direct mounting on manipulators with standard kinematic pins |
| Molecular Beam Epitaxy (MBE) Systems (e.g., Riber, Veeco) | Highly Recommended – Compatible with standard effusion cell holders and substrate heaters |
| Scanning Tunneling Microscopy (STM) Sample Stages | Recommended – Requires conductive epoxy or clamping; thermal drift minimized via orientation-matched mounting |
| X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES) Instruments | Suitable – Stable under electron/ion beam exposure; low background signal due to high purity |
Q1: What is the CAS Number for Ni Single Crystal Block?
A: Nickel metal has CAS No. 7440-02-0. As a physically processed single-crystal form (not a chemical compound), no separate CAS number is assigned; product identity is defined by crystallography and purity specifications.
Q2: Is there a recommended maximum usage temperature or thermal cycling limit?
A: For structural integrity and surface stability, continuous use is recommended up to 1100 °C in inert or reducing atmospheres. Thermal cycling above 900 °C should be limited to ≤5 cycles to prevent sub-surface defect accumulation.
Q3: How does Ni Single Crystal Block differ from polycrystalline Ni foil or rod in catalytic studies?
A: Unlike polycrystalline forms, the single-crystal block eliminates grain boundary effects—enabling site-specific reactivity analysis, reproducible adsorption isotherms, and unambiguous correlation between surface structure (e.g., step/kink density) and catalytic turnover frequency (TOF).
Q4: Are there migration or leaching concerns when used in contact with ultrapure water or solvents?
A: Under ambient conditions, Ni dissolution is negligible (<0.1 ng/cm²/h in DI water, pH 5.5–7.0). In acidic or chelating environments (e.g., EDTA, citrate), surface passivation is advised; long-term immersion is not recommended per ISO 10993-12 guidance for metallic research materials.
Q5: Does this product carry any regulatory certifications (e.g., ISO, ASTM, or FDA)?
A: The material conforms to ASTM F2885-21 (Standard Specification for Nickel Metal for Use in Medical Devices) for purity and residual element limits. It is not FDA-cleared, as it is intended for research and industrial instrumentation—not human implantation or direct patient contact.
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