High-purity bisphenol-A-based solid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low ionic chloride content (< 500 ppm) for enhanced electrical insulation performance.
Optimized melt viscosity for efficient processing in powder coating, filament winding, and prepreg manufacturing.
Superior adhesion to metals, fiberglass, and carbon fiber substrates without requiring surface priming.
Low volatile organic compound (VOC) emission profile, supporting compliance with industrial environmental regulations.
Powder coatings for automotive under-hood components and appliance housings.
Structural composite prepregs used in wind turbine blades and aerospace interior panels.
Electrical encapsulation and insulating varnishes for transformers and high-voltage busbars.
Filament-wound pressure vessels and corrosion-resistant piping systems.
High-performance adhesives for metal-to-metal and metal-to-composite bonding in transportation equipment.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Off-white to light tan solid flakes or pellets |
| Appearance | Free-flowing, homogeneous granular solid |
| Epoxy Equivalent Weight (EEW) | 475–495 g/eq |
| Melt Viscosity (150°C) | 8,000–12,000 cP |
| Glass Transition Temperature (Tg) | 60–65°C (DSC, 10°C/min) |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 85–92°C (Ring & Ball method) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China