Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Photoresist Raw Material Potassium Hydroxide

TokyoOhkaKoKaTOKResistSeriesKOH-PRM1PotassiumHydroxidePhotoresistRawMaterialHigh-purityKOHforsemiconductorphotolithographyensuresprecisedevelopmentcontrolultra-lowmetalimpuritiesandstrictparticlelimitsmeetsJEDECandSEMIstandardswidelyusedinadvancedICandOLEDfabricationprocessescompatiblewithg-linei-lineandKrFexposuresystems.
  • photoresist raw material potassium hydroxide_eddc3cbc
  • photoresist raw material potassium hydroxide_eddc3cbc

Features Of Photoresist Raw Material Potassium Hydroxide

  1. Ultra-high purity grade (≥99.99% KOH) with trace metal impurities strictly controlled to sub-ppb levels for semiconductor-grade photoresist formulation.

  2. Consistent particle size distribution and low moisture content (<0.1%) to ensure reproducible dissolution kinetics in aqueous developer systems.

  3. Stabilized packaging under inert atmosphere (N₂) to prevent carbonate formation and maintain alkalinity stability during storage and handling.

  4. Batch-to-batch analytical certification (ICP-MS, titration, Karl Fischer) supporting IATF 16949 and ISO 9001 traceability requirements.

Typical Applications Of Photoresist Raw Material Potassium Hydroxide

  1. Alkaline developer component in positive-tone photoresists for advanced lithography (i-line, KrF, ArF immersion).

  2. pH modulator and dissolution rate enhancer in chemically amplified resists (CARs) for high-resolution patterning.

  3. Key raw material in TMAH-free alternative developer formulations targeting EUV lithography process compatibility.

  4. Controlled etch accelerator in resist stripping and post-etch residue removal solutions for 300 mm wafer fabs.

Specifications Of Photoresist Raw Material Potassium Hydroxide



Chemical TypeInorganic alkali, potassium hydroxide (KOH)
Product FormWhite crystalline granules or pellets (optional ultra-fine powder upon request)
AppearanceFree-flowing, non-caking white solid; no visible discoloration or foreign particles
Melting Point360 °C (decomposes above 400 °C)
Primary ApplicationsPhotoresist developer formulation, CAR dissolution control, wafer cleaning chemistry
Key FeaturesLow Na⁺, Fe, Ni, Cu, Cr (<1 ppb each by ICP-MS), minimal K₂CO₃ (<50 ppm)
BenefitsImproved critical dimension uniformity (CDU), reduced microbridge defects, extended bath life
Regulatory ComplianceREACH SVHC-free, RoHS 3 compliant, no California Prop 65 listed substances


Compatible Systems Of Photoresist Raw Material Potassium Hydroxide

Common Compatible SystemsSuitability
Standard aqueous photoresist developers (e.g., 0.26 N KOH-based)Highly Recommended – Optimized for consistent dissolution rate and low defect generation
Multi-component developer blends (KOH + organic co-solvents + surfactants)Recommended – Requires pre-mix compatibility testing for long-term colloidal stability
Recycled developer reclamation systems (e.g., ion exchange + ultrafiltration)Suitable – Demonstrated recovery efficiency >92% without carbonate accumulation
TMAH-substituted high-resolution developer platformsHighly Recommended – Validated for <10 nm node patterning in pilot line trials

Photoresist Raw Material Potassium Hydroxide – Frequently Asked Questions (FAQ)

Q1: What is the CAS Number for semiconductor-grade potassium hydroxide used in photoresist applications?

A: The CAS Number is 1310-58-3. Our photoresist-grade material carries a dedicated lot-specific Certificate of Analysis confirming identity, purity, and trace elemental profile per SEMI C37 standards.


Q2: What is the typical concentration range used in photoresist developer formulations?

A: Concentrations typically range from 0.15 N to 0.30 N (≈0.84–1.68 wt%) in deionized water. Higher concentrations may be used in specialized high-throughput tools but require strict temperature and filtration control.


Q3: How does this KOH differ from technical-grade or food-grade potassium hydroxide?

A: Unlike general-purpose grades, our photoresist-grade KOH undergoes double-zone refining, ultra-clean packaging (ISO Class 5 cleanroom), and full trace metal profiling—ensuring Na⁺, Fe, and heavy metals remain below detection limits critical for sub-7 nm lithography yield.


Q4: Is leaching or ion migration into photoresist films a concern during storage or processing?

A: No significant migration occurs under standard conditions. KOH remains fully dissociated in aqueous developer solution and does not penetrate cured resist films; residual surface ions are removed during standard rinse/dry steps per SEMI F57 guidelines.


Q5: Does this material comply with USP/EP pharmaceutical excipient standards?

A: Not applicable — this product is manufactured and qualified exclusively for semiconductor photolithography use per SEMI standards. It is not certified for pharmaceutical, cosmetic, or food applications.



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