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Highly effective aprotic solvent with exceptional solvating power for resins, cellulose esters, and epoxy-based coatings.
Low volatility and high boiling point (101 °C) enable stable performance in elevated-temperature stripping and polishing processes.
Complete miscibility with water, alcohols, ketones, and chlorinated hydrocarbons facilitates formulation flexibility.
Chemically inert under neutral and mildly acidic conditions—minimizes degradation of sensitive substrates during use.
Consistent batch-to-batch purity (>99.9% GC assay) ensures reproducible process outcomes in precision surface treatment applications.
Core raw material in semiconductor wafer photoresist strippers and post-etch residue cleaners.
Key component in aerospace-grade composite surface preparation formulations for adhesive bonding.
Functional solvent in high-gloss optical lens polishing solutions for acrylic and polycarbonate substrates.
Enabling agent in industrial metal finishing systems for selective removal of electrophoretic paint films.
Critical co-solvent in pharmaceutical device coating removal protocols compliant with ISO 10993-12 extraction requirements.
| Chemical Type | Cyclic ether, heterocyclic organic compound |
| Product Form | Clear, colorless liquid |
| Appearance | Transparent, free from suspended matter or discoloration |
| Melting Point | 11.8 °C |
| Boiling Point | 101.1 °C at 760 mmHg |
| Density (20 °C) | 1.033–1.035 g/cm³ |
| Water Solubility | Miscible in all proportions |
| Regulatory Compliance | Meets ASTM D4327 & USP/EP residual solvent Class 2 limits; fully traceable COA available |
| Common Compatible Systems | Suitability |
| Alkaline peroxide-based resist strippers | Highly Recommended – Enhances oxidative stability and substrate compatibility without precipitate formation |
| Acetone/NMP co-solvent polishing blends | Recommended – Improves viscosity control and film dissolution kinetics in high-solid formulations |
| Ultrasonic cleaning platforms (25–80 kHz) | Suitable – Stable under cavitation stress; no decomposition or foaming observed at standard operating temperatures |
| Stainless steel and PTFE-lined process equipment | Highly Recommended – Non-corrosive to 316 SS, Hastelloy C-276, and fluoropolymer wetted components |
Q1: What is the CAS Registry Number for 1,4-dioxane used in polishing and stripping formulations?
A: The CAS Registry Number is 123-91-1. All commercial lots are verified via GC-MS and certified against this identifier in the Certificate of Analysis.
Q2: What is the typical recommended concentration range when formulating with 1,4-dioxane in industrial strippers?
A: For optimized performance and regulatory compliance, recommended usage is 15–35 wt% in final formulations—always validated per substrate sensitivity and process dwell time requirements.
Q3: How does 1,4-dioxane compare to NMP or DMF in terms of residue removal efficiency and environmental profile?
A: 1,4-Dioxane offers superior volatility control and lower dermal absorption potential than NMP or DMF, while delivering comparable resin solvation; it avoids REACH SVHC listing concerns associated with those alternatives.
Q4: Is 1,4-dioxane subject to migration or leaching in medical device cleaning validation studies?
A: When used within validated rinse parameters (≥3× aqueous rinses at ≥50 °C), residual levels consistently fall below 1 ppm—meeting ISO 10993-12 and USP <661.3> thresholds for extractables assessment.
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