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High-purity, low-metal-grade hydrofluoric acid optimized for precision etching and surface conditioning in semiconductor and optical manufacturing.
Controlled volatility and consistent reactivity profile enabling reproducible material removal rates across batch processing.
Stabilized formulation with trace inhibitors to minimize premature decomposition and maintain shelf-life stability under recommended storage conditions.
Supplied in chemically resistant HDPE or PTFE-lined containers compliant with UN 3264 transport regulations for Class 8 corrosive substances.
Batch-certified with CoA (Certificate of Analysis) including assay, heavy metals (Pb, Fe, Cu), particulates (<0.5 µm), and water content.
Primary raw material in buffered oxide etchants (BOE) for silicon dioxide and silicon nitride removal in IC fabrication.
Key component in glass polishing slurries for flat-panel display (FPD) and precision optics manufacturing.
Active ingredient in photoresist stripper formulations for post-etch residue clean in MEMS and advanced packaging processes.
Surface activation agent for ceramic and quartz substrates prior to metallization or bonding steps.
Chemical mechanical planarization (CMP) post-clean additive to remove silica-based slurry residues and native oxide layers.
| Chemical Type | Anhydrous or aqueous hydrofluoric acid (HF), ultra-high purity grade |
| Product Form | Liquid (49% w/w aqueous solution standard; custom concentrations available) |
| Appearance | Clear, colorless liquid; no visible particulates or haze |
| Melting Point | 19.5 °C (for 49% aqueous HF) |
| Boiling Point | 112.2 °C (for 49% aqueous HF) |
| Primary Applications | Etchant precursor, oxide stripping, surface passivation, CMP residue removal |
| Key Features | Low sodium, potassium, calcium, iron, copper, aluminum (<1 ppb each by ICP-MS); <0.1 ppm total metals |
| Regulatory Compliance | REACH registered; TSCA listed; SDS available per OSHA HCS 2012; compliant with ISO 9001:2015 quality system |
| Common Compatible Systems | Suitability |
| Ammonium Fluoride–Hydrofluoric Acid (NH₄F/HF) Buffered Etch Systems | Highly Recommended – Enables precise control of SiO₂ etch rate and selectivity over Si and photoresist |
| Automated Wet Bench Processing Lines (e.g., Modutek, SemiQ, Entegris) | Recommended – Compatible with quartz, PVDF, and PFA fluidic components when properly diluted and temperature-controlled |
| Inline Spray Rinse and Megasonic Cleaning Modules | Suitable – Effective for post-etch residue removal when integrated with DI water rinse and nitrogen dry cycles |
| Recirculating BOE Delivery Systems with Real-Time Conductivity Monitoring | Highly Recommended – Stable performance with minimal drift; supports closed-loop concentration control |
Q1: What is the CAS Registry Number for this hydrofluoric acid grade?
A: The CAS number is 7664-39-3. All batches are traceable to this identifier and verified via FTIR and titrimetric assay.
Q2: Can this HF be used directly in process tools, or does it require dilution?
A: It must be diluted prior to use — typically to 0.5–5% HF in deionized water or buffered solutions. Direct use of concentrated HF is unsafe and incompatible with most tool wet stations.
Q3: How does this grade differ from technical-grade HF in terms of metal contamination?
A: This grade meets SEMI C12 purity standards (<10 ppt transition metals), whereas technical-grade HF may contain >100 ppb Fe/Cu/Al — unacceptable for sub-28nm node fabrication due to device leakage and threshold voltage shift.
Q4: Is there risk of fluorosilicate migration or leaching into downstream process fluids?
A: When used within validated concentration, temperature, and contact time limits — and followed by thorough DI water rinsing — fluorosilicate formation and residual leaching are negligible, as confirmed by TO-15 GC-MS and IC analysis of rinse effluents.
Q5: Does this product comply with EU Biocidal Products Regulation (BPR) or US EPA TSCA requirements for industrial chemical importers?
A: Yes — it is fully TSCA Inventory-listed and exempt from BPR classification, as HF is not used as a biocide but as a process reagent. Full regulatory dossiers and SCIP notifications are available upon request.
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
