Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Polishing Solution and Stripper Raw Material Diethylene Glycol Butyl Ether

Dow Chemical’s DOWANOL™ DB Solvent is a high-purity diethylene glycol butyl ether used as raw material in polishing solutions and paint strippers. It offers excellent solvency for resins, low volatility, and good coupling ability. Widely applied in electronics cleaning, metal finishing, and industrial maintenance formulations for efficient residue removal and surface preparation.
  • polishing solution and stripper raw material diethylene glycol butyl ether_6b734d76
  • polishing solution and stripper raw material diethylene glycol butyl ether_6b734d76

Features Of Polishing Solution and Stripper Raw Material Diethylene Glycol Butyl Ether

  1. High solvency power for resins, lacquers, and cured coatings—enables efficient removal without aggressive abrasion.

  2. Low volatility and favorable evaporation rate—provides extended working time and improved process control in ambient conditions.

  3. Excellent co-solvency with water, alcohols, and glycol ethers—enhances formulation stability and compatibility in multi-component systems.

  4. Low surface tension and high wetting capability—ensures uniform penetration into micro-roughness and interfacial layers.

  5. Non-corrosive to common metals (aluminum, stainless steel, copper) under standard dilution and contact time protocols.

Typical Applications Of Polishing Solution and Stripper Raw Material Diethylene Glycol Butyl Ether

  1. Key active ingredient in industrial-grade paint and varnish strippers for automotive refinishing and aerospace component rework.

  2. Functional solvent in precision optical lens polishing formulations for anti-reflective and hard-coat layer removal.

  3. Performance enhancer in semiconductor wafer cleaning solutions targeting photoresist and spin-on glass residues.

  4. Co-solvent in metal surface pretreatment baths prior to electroplating or anodizing—improves contaminant lift and rinse efficiency.

  5. Stabilizing carrier in high-solids ink stripping systems used in flexible packaging gravure and flexo printing plate maintenance.

Specifications Of Polishing Solution and Stripper Raw Material Diethylene Glycol Butyl Ether



Chemical TypeGlycol ether (dialkyl ether of diethylene glycol)
Product FormClear, colorless liquid
AppearanceTransparent, free from suspended matter
Melting PointApprox. −68 °C
Boiling Point (760 mmHg)Approx. 230 °C
Density (20 °C)0.952–0.958 g/cm³
Solubility in WaterComplete miscibility at 20 °C
Regulatory ComplianceREACH registered; compliant with EU CLP (no CMR classification); TSCA listed


Compatible Systems Of Polishing Solution and Stripper Raw Material Diethylene Glycol Butyl Ether

Common Compatible SystemsSuitability
Aqueous alkaline stripper concentratesHighly Recommended – Enhances hydroxide-mediated ester cleavage and resin swelling
Organic solvent blends (e.g., NMP, DMSO, ethyl lactate)Recommended – Improves viscosity control and reduces overall VOC content
Surfactant-stabilized emulsion systemsSuitable – Acts as coupling agent to maintain phase homogeneity during storage and use
Acid-catalyzed coating dissolution matricesSuitable – Provides thermal stability and prevents premature acid volatilization

Polishing Solution and Stripper Raw Material Diethylene Glycol Butyl Ether – Frequently Asked Questions (FAQ)

Q1: What is the CAS Registry Number for Diethylene Glycol Butyl Ether?

A: The CAS number is 112-34-5.


Q2: What is the typical recommended usage concentration in aqueous stripping formulations?

A: Standard loading ranges from 5–15 wt% in formulated products, depending on substrate sensitivity and target coating thickness—always validate via small-scale compatibility testing.


Q3: How does Diethylene Glycol Butyl Ether compare to Propylene Glycol Butyl Ether (PGBE) in stripping performance?

A: DEGBE exhibits higher boiling point and greater resin solvency than PGBE, making it more effective for thermally stable or crosslinked coatings—but with slightly slower evaporation kinetics in open-air applications.


Q4: Is migration or leaching a concern when used in food-contact equipment cleaning?

A: When applied per validated cleaning protocols—including proper rinsing and drying—residual levels fall well below FDA and EC 10/2011 thresholds; however, direct food-contact approval requires end-product formulation review by regulatory specialists.



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