Polishing Solution and Stripper Raw Material n-Heptane

Features Of Polishing Solution and Stripper Raw Material n-Heptane

1. High-purity hydrocarbon solvent with >99.5% assay, ensuring consistent performance in precision polishing and stripping formulations.

2. Low water content (<50 ppm) minimizes emulsion formation and phase separation in multi-component systems.

3. Controlled volatility (boiling range 98–100 °C) enables efficient residue removal without thermal degradation of sensitive substrates.

4. Non-halogenated and chlorine-free, supporting environmental compliance and reducing corrosion risk on aluminum and stainless steel equipment.

5. Low aromatic content (<0.1%) ensures compatibility with optical-grade polymers and photoresist layers during microelectronics cleaning.

Typical Applications Of Polishing Solution and Stripper Raw Material n-Heptane

1. Primary carrier solvent in semiconductor wafer post-CMP (Chemical Mechanical Polishing) residue removal formulations.

2. Key diluent in industrial metal surface strippers for anodized aluminum, electroplated coatings, and lacquer finishes.

3. Co-solvent in high-gloss optical lens polishing solutions to control evaporation rate and prevent streaking.

4. Extraction medium in pharmaceutical intermediate purification where non-polar selectivity and low toxicity are critical.

5. Process solvent in precision cleaning of MEMS devices and micro-opto-electro-mechanical systems (MOEMS).

Specifications Of Polishing Solution and Stripper Raw Material n-Heptane

Compatible Systems Of Polishing Solution and Stripper Raw Material n-Heptane

Polishing Solution and Stripper Raw Material n-Heptane – Frequently Asked Questions (FAQ)

Q1: What is the CAS Number for n-Heptane used in polishing and stripping formulations?

A: The CAS Registry Number for n-Heptane is 142-82-5. Our specification complies with ACS Reagent Grade and ASTM D845-22 purity standards.

Q2: What is the typical recommended usage concentration when formulating a metal surface stripper?

A: In ready-to-use strippers, n-Heptane typically serves as 30–60 wt% of the solvent phase, balancing evaporation rate, solvency power, and safety thresholds per OSHA PEL (400 ppm TWA).

Q3: How does n-Heptane compare to n-Hexane in polishing applications?

A: n-Heptane offers higher boiling point (+12 °C), lower vapor pressure, and reduced neurotoxicity risk versus n-Hexane—making it preferred for controlled-evaporation polishing steps and safer workplace handling.

Q4: Does this grade meet USP/EP requirements for residual solvent testing in pharmaceutical manufacturing?

A: While not certified to USP <846> or Ph. Eur. 5.4, this grade meets ICH Q3C Class 3 solvent limits (5000 ppm) and is routinely validated for use in non-sterile API intermediate purification where n-Heptane is fully removed prior to final isolation.

Q5: Can n-Heptane cause migration or extraction from polymer substrates during polishing contact?

A: n-Heptane exhibits minimal swelling in polypropylene and HDPE but may extract plasticizers from PVC or low-MW additives from polycarbonate; compatibility testing under actual process time/temperature conditions is strongly advised.