Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Polishing Solution and Stripper Raw Material Glacial Acetic Acid

GlacialAceticAcidbyChemPure™PrecisionSeriesCA-99.99%isahigh-purity(≥99.99%)anhydrousaceticacidusedaskeyrawmaterialinpolishingsolutionsandstrippersforprecisionsemiconductor&opticalcoatingprocesses;meetsSEMI-F47standards,lowmetalimpurities(<1ppb),excellentstability,andcontrolledvolatility.
  • polishing solution and stripper raw material glacial acetic acid_3bc7d40a
  • polishing solution and stripper raw material glacial acetic acid_3bc7d40a

Features Of Polishing Solution and Stripper Raw Material Glacial Acetic Acid

  1. Ultra-high purity (≥99.8% assay) ensures consistent performance in precision polishing and stripping formulations.

  2. Low water content (<0.1%) minimizes side reactions and improves shelf stability in anhydrous chemical systems.

  3. Controlled trace metal profile (Fe < 1 ppm, Cu < 0.5 ppm) prevents catalytic degradation and surface discoloration on sensitive substrates.

  4. Batch-to-batch reproducibility certified via GC and titrimetric analysis per ASTM E260 and ISO 6353-2 standards.

  5. Non-volatile residue < 50 ppm supports clean post-process rinsing and reduces particulate contamination risk.

Typical Applications Of Polishing Solution and Stripper Raw Material Glacial Acetic Acid

  1. Primary acid component in semiconductor CMP (Chemical Mechanical Planarization) slurry formulations for oxide and metal layer removal.

  2. Key pH modulator and complexing agent in electroplating strippers for copper, nickel, and chromium deposits.

  3. Reaction medium and catalyst in synthesis of high-purity acetate-based polishing additives (e.g., ammonium acetate, glycol acetate derivatives).

  4. Co-solvent in photoresist stripper concentrates to enhance solvation power without swelling or etching underlying layers.

  5. Critical raw material for manufacturing ultra-low-sodium acetate buffers used in pharmaceutical-grade surface cleaning agents.

Specifications Of Polishing Solution and Stripper Raw Material Glacial Acetic Acid



Chemical TypeAnhydrous carboxylic acid (ethanoic acid)
Product FormLiquid at room temperature (25°C)
AppearanceClear, colorless liquid with characteristic pungent odor
Melting Point16.6°C (forms ice-like crystals below this temperature)
Boiling Point117.9°C at 760 mmHg
Density1.049 g/cm³ at 25°C
Assay (by GC)≥99.8% (w/w)
Water Content (KF)≤0.08% (w/w)


Compatible Systems Of Polishing Solution and Stripper Raw Material Glacial Acetic Acid

Common Compatible SystemsSuitability
Aqueous amine-based stripper blends (e.g., monoethanolamine + acetic acid)Highly Recommended – Enables synergistic hydrolysis of esterified resins without aggressive corrosion
CMP slurries containing colloidal silica or alumina abrasivesHighly Recommended – Stabilizes dispersion pH between 4.0–5.5; prevents abrasive agglomeration
Organic solvent systems (e.g., PGMEA, DMSO, NMP)Recommended – Miscible in all proportions; enhances solubility of polar organic additives
Stainless steel (316L) and HDPE process equipmentSuitable – Non-oxidizing at ambient temperatures; compatible with standard chemical handling infrastructure

Polishing Solution and Stripper Raw Material Glacial Acetic Acid – Frequently Asked Questions (FAQ)

Q1: What is the CAS Registry Number for this grade of glacial acetic acid?

A: The CAS number is 64-19-7. This product is manufactured and tested to meet ACS Reagent Grade and ISO 9001-certified production requirements.


Q2: What is the recommended usage concentration when formulating a copper stripper?

A: For most alkaline copper strippers, use 5–15% (v/v) glacial acetic acid as a pH buffer and complexation enhancer—always validate via compatibility testing with specific chelants (e.g., EDTA, glycine) and substrate stack.


Q3: How does this grade differ from technical-grade glacial acetic acid in polishing applications?

A: This grade features significantly lower chloride (<1 ppm), sulfate (<2 ppm), and heavy metal impurities—critical to prevent micro-pitting on polished silicon wafers and avoid halide-induced stress corrosion cracking in stainless tooling.


Q4: Is this material compliant with REACH and RoHS directives for electronics manufacturing?

A: Yes—fully compliant with EU REACH (SVHC-free declaration available) and RoHS 2011/65/EU. No restricted substances above threshold limits; full documentation provided with CoA and SDS.


Q5: Does glacial acetic acid migrate or extract into polymer substrates during polishing contact?

A: Minimal migration occurs under typical short-duration (<5 min), room-temperature contact conditions. However, prolonged exposure (>30 min) at elevated temperatures (>40°C) may cause slight plasticization in acetate-sensitive polymers (e.g., cellulose acetate); compatibility testing is advised.



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