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High-resolution patterning capability with sub-micron resolution down to 0.8 µm under standard i-line (365 nm) exposure.
Excellent thermal stability up to 130 °C, enabling robust post-exposure bake (PEB) and etch resistance.
Low outgassing profile suitable for vacuum-compatible lithography processes and cleanroom Class 100 environments.
Optimized adhesion to silicon, SiO₂, and metal substrates without requiring additional HMDS priming in most cases.
Consistent batch-to-batch performance validated via rigorous QC testing including viscosity, solids content, and spectral absorbance.
Microelectromechanical systems (MEMS) fabrication requiring high-aspect-ratio resist profiles.
Semiconductor packaging processes including wafer-level chip-scale packaging (WLCSP).
Advanced display driver IC patterning for OLED and microLED backplane manufacturing.
Power device fabrication on SiC and GaN substrates where thermal and chemical resilience are critical.
Research & development applications in nanofabrication labs utilizing contact and proximity aligners.
| Chemical Type | Novolac resin-based positive photoresist with diazonaphthoquinone (DNQ) sensitizer |
| Product Form | Liquid solution in propylene glycol monomethyl ether acetate (PGMEA) |
| Appearance | Clear, pale yellow to amber homogeneous liquid |
| Viscosity (25 °C) | 22–26 cP (measured per ASTM D445) |
| Solids Content | 20.5–21.5 wt% (by gravimetric analysis) |
| Primary Applications | i-line (365 nm) photolithography for semiconductor, MEMS, and advanced packaging |
| Key Features | High photospeed (~40–60 mJ/cm²), low standing wave effect, minimal T-topping |
| Regulatory Compliance | REACH SVHC-free; RoHS 2015/863 compliant; no intentionally added PFAS |
| Common Compatible Systems | Suitability |
| Canon FPA-3030i5a Stepper | Highly Recommended – Validated for full-field exposure at 365 nm with <1.5% CD variation |
| EVG® 620 Mask Aligner | Highly Recommended – Optimized for proximity mode with <0.3 µm overlay accuracy |
| TOK Coater/Developer Track (ACT series) | Recommended – Compatible with standard process recipes; minor rinse time adjustment advised |
| Screen Semi PSR-3000 Dispenser | Suitable – Requires nozzle temperature control at 22–24 °C for stable dispensing |
Q1: What is the CAS Registry Number for RZJ-390H Photoresist?
A: RZJ-390H is a proprietary multi-component formulation; individual CAS numbers are assigned to key constituents only (e.g., DNQ sensitizer: 2467-02-7; Novolac resin blend: mixture not assigned a single CAS). Full composition disclosure is available under NDA.
Q2: What is the typical spin-coating thickness range and corresponding recommended spin speed?
A: At 21 wt% solids: 1.2–1.4 µm at 3,500 rpm (Si wafers, 30 sec); 2.0–2.3 µm at 2,200 rpm. Thickness uniformity is ±2.5% across 200 mm wafers.
Q3: How does RZJ-390H compare to RZJ-380 in terms of resolution and process latitude?
A: RZJ-390H offers ~15% higher resolution (0.8 µm vs. 0.95 µm) and wider focus latitude (±0.45 µm vs. ±0.32 µm) due to improved DNQ dispersion and lower acid diffusion, while maintaining comparable photospeed.
Q4: Is RZJ-390H compliant with EU food-contact migration limits (EU 10/2011)?
A: Not intended for food-contact applications. RZJ-390H is formulated for industrial microfabrication only and has not been evaluated for extractables/migration per EU 10/2011 or FDA 21 CFR Part 175–177.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
