Ultra-high purity formulation (≥99.95% dimethylamine, low ppb-level metal impurities) optimized for semiconductor-grade process compatibility.
Stabilized aqueous solution with proprietary corrosion inhibitors to minimize stainless steel and fluoropolymer system degradation.
Consistent batch-to-batch reproducibility certified via GC-MS and ICP-MS analytical traceability per SEMI C1–C36 standards.
Controlled volatility profile enabling precise vapor-phase delivery in ALD/CVD tool integration without premature decomposition.
Non-halogenated, low-residue amine structure supporting high-k dielectric and metal nitride film formation with minimal carbon incorporation.
Precursor for atomic layer deposition (ALD) of tantalum nitride (TaN) and titanium nitride (TiN) diffusion barrier layers.
Reducing agent in copper electroless plating baths for advanced interconnect seed layer formation.
Complexing ligand in metal-organic chemical vapor deposition (MOCVD) processes for III–V compound semiconductors.
pH modulator and chelating additive in CMP slurries for tungsten and cobalt polishing formulations.
Surface passivation agent for high-mobility channel materials (e.g., InGaAs, Ge) during epitaxial regrowth.
| Chemical Type | Secondary aliphatic amine (aqueous solution) |
| Product Form | Clear, colorless liquid |
| Dimethylamine Concentration | 38–42 wt% (as specified; certified by titration & GC) |
| Appearance | Transparent, free of suspended solids or phase separation |
| Primary Applications | Semiconductor thin-film deposition, CMP chemistry, electroless plating, surface functionalization |
| Key Features | Low sodium (≤5 ppb), low iron (≤1 ppb), low chloride (≤10 ppb), low sulfate (≤20 ppb) |
| Storage Stability | ≥12 months at 5–25°C in sealed fluoropolymer-lined containers under nitrogen blanket |
| Regulatory Compliance | REACH compliant; non-REACH SVHC; SDS available per GHS Rev.10; no TSCA restrictions |
| Common Compatible Systems | Suitability |
| Applied Materials Centura® ALD Platforms | Highly Recommended – Fully validated for TaN/TiN precursor delivery; compatible with showerhead and pulsed injection modules |
| Lam Research Versys® Metal Etch & Clean Tools | Recommended – Effective as post-etch amine rinse for residue removal; requires dilution control per chamber protocol |
| Entegris UltraPure™ Chemical Delivery Systems | Highly Recommended – Certified for use with FluoroPEEK® tubing, PFA filters, and diaphragm pumps (Class 1 cleanroom rated) |
| DOW Microelectronic CMP Slurry Formulations (e.g., TC-1000 series) | Suitable – Proven stability in pH 9.5–10.2 tungsten slurry matrices; no gelation or viscosity drift observed |
Q1: What is the CAS Number for this product?
A: The CAS Registry Number for dimethylamine (aqueous, 40%) is 124-40-3; this grade carries a unique lot-specific identifier traceable to raw material sourcing and purification history.
Q2: What is the recommended dosage range when used in ALD precursor delivery systems?
A: Typical vapor-phase delivery uses 0.5–2.0 sccm at 60–80°C vaporizer temperature; liquid feed rates range from 0.05–0.3 mL/min depending on reactor pressure and co-reactant flow—always validate with in-situ FTIR or QCM monitoring.
Q3: How does this specialty amine differ from technical-grade dimethylamine 40%?
A: Unlike technical grades, this product undergoes multi-stage sub-ppb metal purification (ICP-MS verified), rigorous particulate filtration (≤10 nm final filter), and real-time amine concentration stabilization—ensuring ≤±0.3% batch variance and zero detectable halides or phosphines.
Q4: Is there data available on extractables/migration into photoresist or low-k dielectrics?
A: Yes—per SEMI F57-0318 testing, extractables in 193nm photoresist (e.g., JSR ARF-1000) show <0.05 ng/cm² dimethylamine residue after 60s rinse at 23°C; no measurable migration into porous SiCOH (k=2.5) after 120s exposure at 40°C.
Q5: Does this product meet USP/EP pharmaceutical excipient requirements?
A: No—this is a semiconductor-grade material manufactured under ISO 9001:2015 and SEMI S2/S8, not under ICH Q5/Q7 or USP <85>. It is not intended for pharmaceutical use.
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