Ultra-low volatility formulation ensures minimal fluid loss during extended high-temperature operation (up to 180 °C).
Non-corrosive to copper, aluminum, stainless steel, and common elastomers used in semiconductor thermal management systems.
Exceptional thermal stability with negligible decomposition or sludge formation after 1,000 hours at 150 °C under inert atmosphere.
Low pour point (–45 °C) enables reliable cold-start performance in precision temperature cycling equipment.
Halogen-free and ROHS-compliant chemistry supports cleanroom-compatible handling and environmental safety requirements.
Temperature control in wafer probers and automated test equipment (ATE) thermal chucks.
Coolant for high-precision photomask inspection systems requiring sub-0.1 °C thermal uniformity.
Heat transfer medium in semiconductor packaging reliability testers (e.g., TCT, HAST chambers).
Thermal interface fluid in laser diode cooling loops for lithography light sources.
Stabilizing fluid for calibration baths used in metrology-grade sensor validation across semiconductor fabs.
| Chemical Type | Synthetic hydrocarbon-based polyalphaolefin (PAO) blend |
| Product Form | Ambient-stable clear liquid |
| Appearance | Colorless to pale yellow, transparent, odorless |
| Melting Point | –45 °C (ASTM D1217) |
| Boiling Point (at 1 atm) | Decomposes >320 °C (no sharp boiling point; TGA onset: 335 °C) |
| Primary Applications | Non-contact thermal control in semiconductor metrology and testing equipment |
| Key Features | Oxidation-resistant, non-volatile, low vapor pressure (<0.01 Pa at 100 °C) |
| Regulatory Compliance | REACH SVHC-free, RoHS 2015/863 compliant, no listed Prop 65 chemicals |
| Common Compatible Systems | Suitability |
| Thermonics TPO Series Thermal Test Platforms | Highly Recommended – Validated for full operational range (–40 °C to +180 °C) |
| Celsius Engineering Micro-Temp Chiller Units | Recommended – Requires standard system flush prior to first use |
| KLA eDRX Thermal Mapping Stations | Suitable – Confirmed compatibility with quartz and fused silica flow paths |
| Chroma 9200 Thermal Test Systems | Highly Recommended – OEM-qualified fluid for all CL7000-enabled configurations |
Q1: What is the CAS Registry Number for CL7000?
A: CL7000 is a proprietary multi-component formulation; individual components are disclosed under NDA, and no single CAS number applies. Full compositional disclosure is available under signed CDA for qualified engineering evaluation.
Q2: Is CL7000 suitable for closed-loop recirculation systems with fluoropolymer tubing (e.g., PFA, FEP)?
A: Yes — CL7000 exhibits excellent chemical compatibility with perfluoroalkoxy (PFA), fluorinated ethylene propylene (FEP), and ETFE tubing. No swelling, leaching, or extractables observed after 6-month continuous exposure at 120 °C.
Q3: How does CL7000 compare to standard silicone oils in semiconductor thermal applications?
A: Unlike silicone oils, CL7000 contains zero volatile cyclic siloxanes (D4/D5/D6), eliminating risk of vacuum chamber contamination and sensor fouling. It also offers superior oxidation resistance and lower outgassing (RML <1.0 × 10⁻⁶ g/cm²·s at 120 °C per ASTM E595).
Q4: Does CL7000 require special disposal procedures?
A: CL7000 is classified as non-hazardous for landfill disposal per EPA 40 CFR Part 261 when uncontaminated. For spent fluid, confirm local regulations; recycling via licensed hydrocarbon re-refining is recommended.
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