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High thermal stability with glass transition temperature (Tg) exceeding 180 °C after curing.
Excellent chemical resistance to acids, alkalis, and solvents in demanding industrial environments.
Low viscosity formulation enabling easy processing, impregnation, and void-free encapsulation.
Outstanding electrical insulation properties suitable for high-voltage and aerospace-grade applications.
Halogen-free composition compliant with RoHS and REACH regulatory requirements.
High-reliability encapsulation of power semiconductor modules (e.g., IGBTs and SiC devices).
Advanced printed circuit board (PCB) underfill and molding compounds for automotive electronics.
Thermal interface materials and bonding adhesives in electric vehicle battery management systems.
Insulating coatings and potting compounds for high-frequency transformers and inductors.
| Chemical Type | Multi-functional epoxy resin based on bisphenol-F and cyanurate structure |
| Product Form | Off-white to light yellow solid granules or powder |
| Appearance | Free-flowing crystalline solid at room temperature |
| Primary Applications | High-performance encapsulation, molding, and structural adhesives |
| Key Features | High Tg, low moisture absorption, excellent dielectric strength |
| Benefits | Enhanced long-term reliability under thermal cycling and humidity stress |
| Storage Conditions | Store below 25 °C in dry, sealed containers; protect from moisture |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
