SYS-9070 Silicon Wafer Cleaning Solution and Post-Dry Etch Cleaning Solution

Features Of SYS-9070 Silicon Wafer Cleaning Solution and Post-Dry Etch Cleaning Solution

1. Highly selective removal of post-dry etch residues—including fluorocarbon polymers, metal halides, and silicon-based particulates—without attacking underlying Si, SiO₂, or low-k dielectrics.

2. Low surface tension and high wettability ensure uniform coverage and effective cleaning in high-aspect-ratio features (≥20:1).

3. Non-oxidizing formulation minimizes native oxide regrowth and surface roughening during post-etch cleaning.

4. Stable at ambient temperature with >12-month shelf life when sealed; compatible with standard DI water dilution protocols (1:5 to 1:20 v/v).

5. Free of heavy metals, halogens (Cl⁻, Br⁻), and amine-based corrosion promoters—meets SEMI S2/S8 safety and purity requirements.

Typical Applications Of SYS-9070 Silicon Wafer Cleaning Solution and Post-Dry Etch Cleaning Solution

1. Cleaning after fluorine-based plasma etching (e.g., SF₆, CF₄, C₄F₈) of silicon, silicon nitride, and polysilicon layers.

2. Residue removal following deep reactive ion etching (DRIE) of MEMS and advanced packaging substrates.

3. Post-etch cleaning for 3D NAND and DRAM pattern transfer processes involving multi-layer hard masks.

4. Final rinse step prior to epitaxial growth or atomic layer deposition (ALD) to eliminate trace contaminants.

5. Wafer-level cleaning for compound semiconductor devices (GaAs, SiC) where chloride-free chemistry is critical.

Specifications Of SYS-9070 Silicon Wafer Cleaning Solution and Post-Dry Etch Cleaning Solution

Compatible Systems Of SYS-9070 Silicon Wafer Cleaning Solution and Post-Dry Etch Cleaning Solution

SYS-9070 Silicon Wafer Cleaning Solution and Post-Dry Etch Cleaning Solution – Frequently Asked Questions (FAQ)

Q1: What is the CAS Registry Number for SYS-9070?

A: SYS-9070 is a proprietary multi-component formulation; individual ingredients are disclosed under confidentiality agreement, and the mixture itself does not carry a CAS number per IUPAC guidelines for complex commercial blends.

Q2: What is the recommended working concentration and process temperature?

A: Dilute 5–20 vol% in ultrapure water (18.2 MΩ·cm, TOC < 1 ppb); operate at 20–25°C. Higher concentrations (>15%) may be used for aggressive residue loads, with dwell time adjusted to 30–120 seconds.

Q3: How does SYS-9070 compare to traditional SC1 (NH₄OH:H₂O₂:H₂O) solutions?

A: Unlike SC1, SYS-9070 is non-oxidizing, eliminates silicon surface pitting and micro-roughness, avoids ammonium salt precipitation, and enables direct transition to hydrophobic surfaces without additional surface modification steps.

Q4: Has SYS-9070 been tested for extractables and leachables in contact with fluoropolymer fluid-handling components?

A: Yes—validated per USP <87> and <88> for Class VI biocompatibility; shows negligible fluorinated extractables (<0.5 µg/mL) when circulated through PFA, FEP, and ETFE tubing at 25°C for 72 hours.

Q5: Does SYS-9070 require special waste treatment before discharge?

A: No heavy metal or halogen content requires specialized neutralization; standard acidic/alkaline pH adjustment followed by precipitation and filtration meets local industrial wastewater discharge limits (e.g., EPA 40 CFR Part 417).