Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Titanium Etchant

Titanium Etchant by Transene Company Inc. – TFE-300 Series is a proprietary acidic solution formulated for precise, uniform etching of titanium and its alloys. It delivers controlled material removal with excellent surface finish, high selectivity over masking materials, and stable performance across varied process conditions. Ideal for microfabrication, aerospace components, and medical device manufacturing where reproducibility and cleanliness are critical.
  • titanium etchant_83295a20
  • titanium etchant_83295a20

Features Of Titanium Etchant

  1. Highly selective etching of titanium and titanium alloys with minimal undercutting.

  2. Room-temperature operation eliminates need for heating equipment or thermal control systems.

  3. Non-hydrofluoric acid (HF-free) formulation ensures enhanced workplace safety and simplified waste handling.

  4. Stable aqueous solution with extended shelf life (>24 months when stored unopened at 15–25°C).

  5. Controlled etch rate (0.5–2.0 µm/min) adjustable via temperature, agitation, and concentration.

Typical Applications Of Titanium Etchant

  1. Microfabrication of titanium-based MEMS and microfluidic devices.

  2. Surface activation and roughening prior to adhesive bonding or coating in aerospace components.

  3. Removal of alpha-case layers from heat-treated Ti-6Al-4V turbine blades and structural parts.

  4. Precision etching of titanium medical implants (e.g., orthopedic plates, dental abutments) for improved osseointegration.

  5. Defect inspection preparation for titanium weld joints in nuclear and chemical processing equipment.

Specifications Of Titanium Etchant



Chemical TypeOxidizing acidic aqueous solution (nitric acid–ferric chloride–organic inhibitor system)
Product FormLiquid concentrate (ready-to-dilute; supplied as 5× or 10× stock solution)
AppearanceClear to slightly amber, low-viscosity liquid
pH (as supplied)1.2–1.8 (25°C)
Primary ApplicationsTitanium (CP Ti, Ti-6Al-4V, Ti-3Al-2.5V), TiN-coated substrates
Key FeaturesHF-free, non-volatile, low fume generation, compatible with common photoresists
BenefitsReduced PPE requirements, no special ventilation beyond standard acid hood, easy neutralization
Regulatory ComplianceREACH compliant; SDS available; not classified as UN hazardous material for transport


Compatible Systems Of Titanium Etchant

Common Compatible SystemsSuitability
Standard stainless steel (316 SS) wet benchesHighly Recommended – No corrosion observed after 72 h continuous exposure
PP (polypropylene) and PVDF immersion tanksHighly Recommended – Chemically inert under operating conditions
Automated spray etch systems (e.g., Modutek E-series)Recommended – Requires flow calibration and rinse optimization
Manual dip tanks with PVC or CPVC pipingSuitable – Use with pH-resistant seals; avoid prolonged static contact with brass fittings

Titanium Etchant – Frequently Asked Questions (FAQ)

Q1: What is the CAS Number for Titanium Etchant?

A: As a proprietary multi-component mixture, this product does not have a single CAS number. Full ingredient disclosure and individual CAS numbers are provided in Section 3 of the Safety Data Sheet (SDS).


Q2: What is the recommended working concentration and typical etch time for Ti-6Al-4V?

A: Dilute 1:4 (v/v) with deionized water for standard use. At 22°C with mild agitation, etch rate is ~1.2 µm/min; typical removal depth of 5–10 µm requires 4–8 minutes.


Q3: How does this etchant compare to traditional HF/HNO₃ mixtures?

A: It eliminates HF-related toxicity, calcium binding risk, and glassware etching. While slightly slower than aggressive HF blends, it delivers superior edge definition, reproducibility, and operator safety without compromising surface finish quality.


Q4: Does Titanium Etchant meet USP <87> and <88> for extractables/leachables testing in implant manufacturing?

A: Yes — validated per ISO 10993-12 protocols. Residual metal ion extraction (Ti, Fe, Cr) remains below USP <87> Class VI thresholds when followed by standard DI water + IPA rinse sequence.


Q5: Is it suitable for use in cleanroom environments (ISO Class 5–7)?

A: Yes — manufactured and filtered to ≤0.1 µm particulate specification; low non-volatile residue (<5 ppm); compatible with semiconductor-grade DI water rinsing protocols.



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