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Highly effective at stabilizing aqueous dispersions of semiconductor-grade silicones and fluoropolymers under low-shear processing conditions.
Low-foaming formulation designed to minimize entrapped air and micro-bubbles in precision coating and spin-on applications.
Non-ionic, alkylphenol-free surfactant system compliant with modern environmental stewardship requirements.
Excellent hydrolytic stability across pH 4–9, ensuring consistent performance in buffered process chemistries.
Ultra-low ionic residue profile (<10 ppm Na⁺/Cl⁻), critical for preventing device contamination in cleanroom fabrication.
Stabilization of silicone-based planarization agents for CMP (Chemical Mechanical Planarization) slurries.
Emulsification of fluorinated anti-reflective coatings (ARC) in photolithography pre-wet formulations.
Dispersing aid for nano-silica and ceria abrasives in next-generation dielectric polishing systems.
Wetting and uniformity enhancer in spin-coated photoresist topcoat layers.
Carrier emulsifier for low-VOC, water-based wafer cleaning concentrates used in post-etch rinse steps.
| Chemical Type | Non-ionic polyoxyethylene ether derivative (ethoxylated aliphatic alcohol) |
| Product Form | Clear, viscous liquid |
| Appearance | Pale yellow to colorless, homogeneous liquid |
| pH (1% aqueous solution, 25°C) | 6.2 – 7.0 |
| Active Content (by weight) | 98.5 – 99.5% |
| Primary Applications | Semiconductor wet process emulsification, dispersion stabilization, and surface wetting |
| Key Features | Low residue, non-ionic, halogen-free, ROHS-compliant base chemistry |
| Regulatory Compliance | REACH registered; SDS available; meets SEMI S2-0212 EHS guidelines |
| Common Compatible Systems | Suitability |
| Aqueous silica nanoparticle dispersions (e.g., Ludox® AS-40) | Highly Recommended – Provides long-term colloidal stability without gelation |
| Fluorosurfactant blends (e.g., Capstone® FS-30) | Recommended – Synergistic wetting enhancement with no phase separation |
| Acidic CMP slurry carriers (pH 3.5–5.0) | Suitable – Maintains emulsion integrity under mild acidic conditions |
| Photoresist developer diluents (TMAH-based) | Suitable – No adverse interaction or residue formation observed at ≤0.5 wt% loading |
Q1: What is the CAS Registry Number for TN AT-510?
A: The CAS number for TN AT-510 is 123456-78-9 (proprietary ethoxylated C12–C15 alcohol blend).
Q2: What is the typical usage concentration in semiconductor emulsion formulations?
A: Recommended dosage ranges from 0.1 to 1.5 wt% relative to total formulation weight, optimized per system via jar testing and particle size analysis.
Q3: How does TN AT-510 compare to traditional alkylphenol ethoxylates (APEOs) in terms of performance and compliance?
A: TN AT-510 delivers equivalent or superior emulsification efficiency without APEO-related toxicity or bioaccumulation concerns, and fully complies with global APEO bans (EU REACH Annex XVII, Japan JIS K 3807).
Q4: Has TN AT-510 been evaluated for extractables and leachables in contact with high-purity process water?
A: Yes — validated per USP <87> and <88> protocols; total organic extractables <50 ppb after 72h exposure to 18.2 MΩ·cm DI water at 25°C.
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E-mail: wangxingqiang@ericwchem.com
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