Ultra-low metallic impurities (<10 ppt for Na, K, Ca, Fe, Cu, Ni, Zn, Cr, Al) meeting SEMI C1/C7 standards.
Negligible particle count (<1 particle/mL at ≥0.1 μm) verified by laser particle counting per SEMI F39.
Controlled organic residue levels (<50 ppb total TOC) ensuring minimal carbon contamination during wafer cleaning.
Stabilized formulation with proprietary chelating agents to prevent catalytic decomposition and maintain shelf-life stability.
Manufactured and packaged in ISO Class 4 (Class 10) cleanrooms under strict nitrogen-purged, double-bagged HDPE or fluoropolymer-lined containers.
SC-1 (Standard Clean-1) solution component for removal of organic residues and native oxide thinning in front-end-of-line (FEOL) silicon wafer processing.
Oxidizing agent in copper post-CMP (Chemical Mechanical Polishing) cleaning to remove residual slurry and suppress copper corrosion.
Photoresist stripping aid in advanced node (≤28 nm) logic and memory fabrication, particularly for low-k dielectric compatibility.
Surface activation and hydrophilization prior to ALD (Atomic Layer Deposition) or CVD (Chemical Vapor Deposition) precursor adsorption.
Final rinse additive in high-purity DI water systems to reduce trace metal redeposition on patterned wafers.
| Chemical Type | Hydrogen Peroxide (H₂O₂), aqueous solution |
| Product Form | Liquid, stabilized |
| Concentration | 30.0 ± 0.5 wt% (standard grade); custom concentrations available (29–31 wt%) |
| Appearance | Clear, colorless liquid; no visible particulates or haze |
| Melting Point | −0.43 °C (for 30% aqueous solution) |
| Primary Applications | Wafer cleaning, oxidation, photoresist modification, surface activation |
| Key Features | SEMI C1/C7 compliant, ultra-low metals, low particles, low TOC, nitrogen-stabilized |
| Regulatory Compliance | REACH registered, RoHS compliant, SDS available; not classified as UN 5.1 oxidizer for transport when ≤30 wt% |
| Common Compatible Systems | Suitability |
| SEZ (now SCREEN) AURA® and DAINIPPON SCREEN wet benches | Highly Recommended – Fully validated for SC-1, SC-2, and dilute H₂O₂ rinse modules |
| TOKYO ELECTRON (TEL) Unity® and Clean Track™ platforms | Highly Recommended – Certified for inline H₂O₂ delivery and temperature-controlled mixing |
| Lam Research SOLA™ and VECTOR™ wet processing tools | Recommended – Compatible with standard chemical delivery manifolds and filtration systems |
| Custom-built batch immersion stations with PFA/PTFE fluid paths | Suitable – Requires sub-micron final filtration (0.05 μm) and inert gas purging |
Q1: What is the CAS Number for Electronic Grade Hydrogen Peroxide?
A: The CAS Number is 7722-84-1. This applies to hydrogen peroxide in all aqueous concentrations; our electronic grade material is identified with lot-specific purity certification.
Q2: How should this product be stored to maintain stability and purity?
A: Store unopened containers upright in a cool (10–25 °C), dry, dark environment under nitrogen blanket. Avoid exposure to stainless steel, copper, or iron surfaces; use only fluoropolymer (PFA, ETFE) or high-density polyethylene (HDPE) contact materials. Shelf life is 12 months from date of manufacture when stored properly.
Q3: Does this product meet SEMI SP1 and SEMI SP2 requirements for metallic contamination?
A: Yes — our electronic grade hydrogen peroxide meets or exceeds SEMI SP1 (for 300 mm wafers) and SEMI SP2 (for 200 mm wafers) specifications for metallic impurities, including rigorous testing for Ag, As, Au, Ba, Be, Bi, Cd, Co, Cs, Ga, Ge, In, Ir, La, Li, Mg, Mn, Mo, Nb, Pd, Pb, Pr, Rb, Re, Sb, Sc, Se, Si, Sm, Sr, Ta, Te, Th, Ti, Tl, U, V, W, Y, Yb, and Zr at sub-ppt detection limits.
Q4: Is there risk of extractables or leachables when used with PFA tubing or quartz components?
A: No significant extractables are observed under typical process conditions (≤60 °C, <5 min dwell time). Independent testing per SEMI F57 confirms <1 ppt total extractable metals and <10 ppb organic leachables (by GC-MS) from certified PFA and high-purity quartz after 72-hour static exposure at 25 °C.
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China